SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 306

• Manufacturer Part Number: SAM9G10
• Manufacturer: Atmel Corporation

Specifications of SAM9G10

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 266 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 1
• Uart: 4
• Ssc: 3
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

25.5.4.1
306
306
Hardware Configuration
Software Configuration
SAM9G35
SAM9G35
2x8-bit DDR2 on EBI
The DDR2 initialization sequence is described in the sub-section “DDR2 Device Initialization” of
the DDRSDRC section.
In this case VDDNF can be different from VDDIOM. NAND Flash device can be 3.3V or 1.8V
and wired on D16-D31 data bus. NFD0_ON_D16 is to be set to 1.
• Assign EBI_CS1 to the DDR2 controller by setting the EBI_CS1A bit in the EBI Chip Select
• Initialize the DDR2 Controller depending on the DDR2 device and system bus frequency.
Register located in the bus matrix memory space.
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11