SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 609
SAM9G10
Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(1274 pages)
2.SAM9261.pdf
(43 pages)
3.SAM9G10.pdf
(750 pages)
4.SAM9G10.pdf
(39 pages)
Specifications of SAM9G10
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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34.4
34.5
Table 34-1.
Notes:
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
Pin Name
MCCDA
MCCK
MCDA0 - MCDA3
Application Block Diagram
Pin Name List
1. I: Input, O: Output, PP: Push/Pull, OD: Open Drain.
2. When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK, MCCDA to HSMCIx_CDA,
(2)
MCDAy to HSMCIx_DAy.
I/O Lines Description for 4-bit Configuration
Figure 34-2. Application Block Diagram
Pin Description
Command/response
Clock
Data 0..3 of Slot A
9 1011
1
2 3 4 5 6
ex: File System, Audio, Security, etc.
MMC
1213 8
Type
I/O/PP/OD
I/O
I/O/PP
Application Layer
7
HSMCI Interface
Physical Layer
(1)
9
1
2 3 4 5 6
Comments
CMD of an MMC or SDCard/SDIO
CLK of an MMC or SD Card/SDIO
DAT[0..3] of an MMC
DAT[0..3] of an SD Card/SDIO
SDCard
7 8
SAM9G35
SAM9G35
609
609
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