1-1926732-8 TE Connectivity, 1-1926732-8 Datasheet - Page 7
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1-1926732-8
Manufacturer Part Number
1-1926732-8
Description
Manufacturer
TE Connectivity
Specifications of 1-1926732-8
Pcb Mount Alignment
Without
Pcb Mount Retention
With
Pcb Mounting Orientation
Right Angle
Make First / Break Last
Yes
Product Line
MINIPAK HDL
Ul File Number
E28476
Termination Method To Pc Board
Through Hole - Press Fit
Sealed
No
Number Of Power Positions
8
Operating Voltage Reference
AC
Operating Voltage (vac)
250
Hot Pluggable
No
Tail Length (mm [in])
3.3 [0.13]
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
8.00 [0.315]
Number Of Signal Positions
25
Number Of Positions
33
Pcb Mount Retention Type
Screw Mount
Selectively Loaded
Yes
Centerline (mm [in])
2.00 [0.079]
Centerline, Power Contacts (mm [in])
2.75 [0.108]
Underplate Material Thickness (µm [?in])
1.27 [50.000]
Length (x-axis) (mm [in])
46.21 [1.820]
Width (z-axis) (mm [in])
32.50 [1.2795]
Number Of Rows
1
Mating Retention
Without
Tail Plating Material
Bright Tin-Lead
Contact Type
Pin
Contact Base Material
Copper
Contact Plating, Mating Area, Material
Gold or Palladium Nickel or Performance Based
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Tail Plating, Thickness (µm [?in])
0.5 [20]
Underplate Material
Nickel
Contact Design
Single Beam
Connector Style
Plug
Mating Alignment
With
Housing Material
Crystal Polymer
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Mating Alignment Type
Passive Guide
Connector Contact Configuration (no. Of Pos./type)
25/Signal, 8/AC Power
Custom Configurable
No
Rohs/elv Compliance
RoHS/Not ELV Compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS not ELV compliant
Agency/standard
UL, CSA
Ul Rating
Recognized
Ul Voltage Rating (vac)
250
Csa Certified
Yes
Operating Temperature (°c [°f])
-40 – +125 [-40 – +257]
Pcb Thickness, Recommended (mm [in])
1.40 [0.055]
Applies To
Printed Circuit Board
Board-to-board Configuration
Co-Planar
Contact Transmits (typical Application)
Signal (Data)/ Power
Application Use
Board-to-Board
Pick And Place Cover
Without
Packaging Method
Tray
3.6.
Rev B
Initial examination of product
LLCR, signal and power contacts
LLCR, power contacts only
Contact resistance at rated current, power contacts
Insulation resistance
Withstanding voltage
Temperature rise vs current
Vibration, random
Mechanical shock
Durability
Mating force
Unmating force
Compliant pin insertion
Compliant pin retention
Static load, transverse
Contact retention
Minute disturbance
Component heat resistance to wave soldering
Thermal shock
Humidity/temperature cycling
Temperature life
Mixed flowing gas
Dust
Final examination of product
Product Qualification and Requalification Test Sequence
NOTE
(a)
(b)
(c)
(d)
(e)
(f)
(g)
(h)
Test or Examination
See paragraph 4.1.A.
Test on boards.
Insertion only for fully loaded connectors, insertion and retention for loose power plug
contacts and loose signal chicklet contacts.
Numbers indicate sequence in which tests are performed.
Energize at current for 18 C temperature rise.
Precondition specimens with 10 durability cycles.
Power only in housing, signal only in housing, and signal and power in housing.
Measure LLCR after 10 days unmated exposure.
3(f)(h)
2,4,6
Figure 4
1
1
5
7
2(g)
8(g)
3,7
2
1
5
6
4
9
2,6
3,7
3
1
4
5
8
2,4
5
4
1
3
Test Sequence (d)
Test Group (a)
2,4,6,8
3(f),9
7(e)
10
11
5
1
5
6(b) 7(c)
1
2
3
1
2
3
4
2,4,6
3(f)
8
1
5
7
9
1
2
3
108-2325
10
1
2
3
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