AD9963 Analog Devices, AD9963 Datasheet - Page 8

• Manufacturer Part Number: AD9963
• Description: 10-/12-Bit, Low Power, Broadband MxFE
• Manufacturer: Analog Devices

Specifications of AD9963

• Resolution (bits): 12bit
• Throughput Rate: 100MSPS
• # Chan: 2
• Supply V: Multi(+1.8Anlg, +1.8Dig),Multi(+1.8Anlg, +3.3Dig) ,Single(+1.8),Single(+3.3)
• Sample Rate: 100MSPS
• Adc Bits X #adcs-speed: 12x2-100 MHz
• Dac Bits X #dacs-clkspeed: 12x2-170 MHz
• Pkg Type: CSP
• Primary Application: Broadband Wireless

AD9961/AD9963
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
RX33V, AUX33V
TXVDD
DRVDD
CLK33V
RX18V, RX18VF
DVDD18V
CLK18V, DLL18V
RXGND, TXGND, DGND,
TXIP, TXIN, TXQP, TXQN
RXIP, RXIN, RXQP, RXQN
CS
LDO_EN
TRXD[11:0], TXD[11:0], TXIQ,
TRXIQ, TXCLK, TRXCLK
CLKP, CLKN
Junction Temperature
Storage Temperature Range
, SCLK, SDIO,
RESET ,
With
Respect to
RXGND
TXGND
DGND
EPAD
RXGND
EPAD
EPAD
EPAD
TXGND
RXGND
DGND
DGND
EPAD
Rating
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 to +2.1 V
−0.3 to +2.1 V
−0.3 to +2.1 V
−0.3 V to +0.3 V
−1.0 V to TXVDD +
0.3 V
−0.3 V to RX18V +
0.3 V
−0.3V to DRVDD +
0.3 V
−0.3 V to DRVDD +
0.3 V
−0.3 V to CLK33V +
0.3 V
+125°C
−65°C to +150°C
Rev. 0 | Page 8 of 60
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Airflow
1 m/sec
0 m/sec
Typical θ
High-κ thermal test board. Airflow increases heat dissipation,
effectively reducing θ
the package leads from metal traces, through holes, ground, and
power planes, reduces the θ
ESD CAUTION
JA
, θ
JB
, and θ
JC
JA
. In addition, metal in direct contact with
are specified for a JEDEC standard 51-7
JA
.
θ
17.1
20.3
JA
θ
10.6
JB
θ
1.0
JC
Unit
°C/W
°C/W