AD6645 Analog Devices, AD6645 Datasheet - Page 24

• Manufacturer Part Number: AD6645
• Description: 14-Bit, 80 MSPS/105 MSPS A/D Converter
• Manufacturer: Analog Devices

Specifications of AD6645

• Resolution (bits): 14bit
• # Chan: 1
• Sample Rate: 105MSPS
• Interface: Par
• Analog Input Type: Diff-Uni
• Ain Range: 2.2 V p-p
• Adc Architecture: Pipelined
• Pkg Type: QFP

AD6645
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD6645ASQ-80
AD6645ASQZ-80
AD6645ASVZ-80
AD6645ASQ-105
AD6645ASQZ-105
AD6645ASVZ-105
AD6645-80/PCBZ
AD6645-105/PCBZ
1
©2002–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1.05
1.00
0.95
0.15
0.05
ROTATED 90 ° CCW
1.45
1.40
1.35
VIEW A
ROTATED 90° CCW
1
1
0.15
0.05
1
1
1
1
0° MIN
VIEW A
SEATING
PLANE
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−10°C to +85°C
−10°C to +85°C
−10°C to +85°C
SEATING
0.08 MAX
COPLANARITY
0.75
0.60
0.45
PLANE
0.20
0.09
3.5°
7°
0°
0.10 MAX
COPLANARITY
0.20
0.08
7°
0°
1.20
MAX
Figure 48. 52-Lead Low Profile Quad Flat Package, PowerQuad [LQFP_PQ4]
D02647-0-10/08(D)
Figure 49. 52-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
13
1
VIEW A
52
14
COMPLIANT TO JEDEC STANDARDS MS-026-BCC-HD
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-ACC
Package Description
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Low Profile Quad Flat Package, PowerQuad (LQFP_PQ4)
52-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Evaluation Board
Evaluation Board
13
1
52
14
(PINS DOWN)
12.00 BSC
TOP VIEW
Dimensions shown in millimeters
Dimensions shown in millimeters
LEAD PITCH
SQ
12.20
12.00 SQ
11.80
BSC
(PINS DOWN)
0.65
TOP VIEW
Rev. D | Page 24 of 24
(SQ-52-1)
(SV-52-1)
40
26
0.38
0.32
0.22
39
27
BSC SQ
40
26
10.00
39
27
2.65
2.50 (4 PLCS)
2.35
39
27
27
39
26
40
26
40
LEAD PITCH
BSC
0.65
BOTTOM VIEW
BOTTOM VIEW
EXPOSED
HEAT SINK
(CENTERED)
(PINS UP)
EXPOSED
(PINS UP)
PAD
2.35
2.20 (4 PLCS)
2.05
0.38
0.32
0.22
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
52
14
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
14
52
13
1
13
1
6.50 BSC
6.05
5.90 SQ
5.75
SQ
10.20
10.00 SQ
9.80
Package Option
SQ-52-1
SQ-52-1
SV-52-1
SQ-52-1
SQ-52-1
SV-52-1