AD6645 Analog Devices, AD6645 Datasheet - Page 7

• Manufacturer Part Number: AD6645
• Description: 14-Bit, 80 MSPS/105 MSPS A/D Converter
• Manufacturer: Analog Devices

Specifications of AD6645

• Resolution (bits): 14bit
• # Chan: 1
• Sample Rate: 105MSPS
• Interface: Par
• Analog Input Type: Diff-Uni
• Ain Range: 2.2 V p-p
• Adc Architecture: Pipelined
• Pkg Type: QFP

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Electrical
Environmental
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The heat sink of the AD6645ASVZ, 52-lead TQFP_EP (SV-52-1)
package must be soldered to the PCB GND plane to meet thermal
specifications.
Table 6. Thermal Characteristics
Package Type
52-Lead TQFP_EP
52-Lead LQFP_PQ4
1
2
3
4
5
6
7
Per JEDEC JESD51-2 (heat sink soldered to PCB).
2S2P JEDEC test board.
Values of θ
considerations.
Per JEDEC JESD51-6 (heat sink soldered to PCB).
Airflow increases heat dissipation, effectively reducing θ
more metal that is directly in contact with the package leads from metal
traces, throughholes, ground, and power planes, the more θ
Per MIL-STD-883, Method 1012.1.
Values of θ
considerations when an external heat sink is required.
θ
θ
θ
θ
θ
θ
θ
θ
AV
DV
Analog Input Voltage
Analog Input Current
Digital Input Voltage
Digital Output Current
Operating Temperature Range (Ambient)
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
Storage Temperature Range (Ambient)
JA
JMA
JC
JA
JMA
JA
JMA
JC
AD6645-80
AD6645-105
6, 7
6, 7
CC
CC
(0 m/sec airflow)
(0 m/sec airflow)
(0 m/sec airflow)
(1.0 m/sec airflow)
(1.0 m/sec airflow)
(1.0 m/sec airflow)
Voltage
Voltage
JA
JC
are provided for package comparison and PCB design
are provided for package comparison and PCB design
1, 2, 3
1, 2, 3
1, 2, 3
2, 3, 4, 5
2, 3, 4, 5
2, 3, 4, 5
Rating
23°C/W, soldered heat sink
17°C/W, soldered heat sink
2°C/W, soldered heat sink
30°C/W, unsoldered heat sink
24°C/W, unsoldered heat sink
23°C/W, soldered heat sink
17°C/W, soldered heat sink
2°C/W
JA
Rating
0 V to 7 V
0 V to 7 V
0 V to AV
25 mA
0 V to AV
4 mA
−40°C to +85°C
−10°C to +85°C
150°C
300°C
−65°C to +150°C
. Furthermore, the
JA
is reduced.
CC
CC
Rev. D | Page 7 of 24
Values of θ
design considerations. θ
approximation of T
where:
T
PD is the power dissipation (W).
EXPLANATION OF TEST LEVELS
I.
II.
III.
IV.
V.
ESD CAUTION
A
is the ambient temperature (°C).
T
100% production tested.
100% production tested at 25°C and guaranteed by design
and characterization at temperature extremes.
Sample tested only.
Parameter is guaranteed by design and characterization
testing.
Parameter is a typical value only.
J
= T
JA
A
+ (θ
are provided for package comparison and PCB
JA
× PD)
J
by the equation
JA
can be used for a first-order
AD6645