ADUC7022 Analog Devices, ADUC7022 Datasheet - Page 93

• Manufacturer Part Number: ADUC7022
• Manufacturer: Analog Devices

Specifications of ADUC7022

• Mcu Core: ARM7 TDMI
• Mcu Speed (mips): 40
• Sram (bytes): 8192Bytes
• Gpio Pins: 13
• Adc # Channels: 10

* 1.40 MAX
1.45
1.40
1.35
ROTATED 90° CCW
0.15
0.05
1.50
SQ
VIEW A
SEATING
PLANE
DETAIL A
TOP VIEW
Figure 89. 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
6.10
6.00 SQ
5.90
0.08
COPLANARITY
BALL A1
PAD CORNER
Figure 88. 80-Lead Low Profile Quad Flat Package [LQFP]
0.20
0.09
COMPLIANT TO JEDEC STANDARDS MS-026-BDD
3.5°
7°
0°
* COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
0.75
0.60
0.45
Dimensions shown in millimeters
Dimensions shown in millimeters
Rev. D | Page 93 of 96
4.55 SQ
0.15 MIN
1.60
MAX
(BC-64-4)
(ST-80-1)
BALL DIAMETER
0.65
VIEW A
20
1
80
8
21
LEAD PITCH
ADuC7019/20/21/22/24/25/26/27/28/29
0.45
0.40
0.35
7
BOTTOM VIEW
BSC
DETAIL A
PIN 1
0.50
6
(PINS DOWN)
TOP VIEW
5
14.20
14.00 SQ
13.80
INDEX AREA
4
A1 CORNER
3
2
0.27
0.22
0.17
SEATING
PLANE
1
B
D
E
F
H
61
40
A
C
G
0.65 MIN
60
41
COPLANARITY
0.10
12.20
12.00 SQ
11.80