TDA1519C NXP Semiconductors, TDA1519C Datasheet - Page 18

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TDA1519C

Manufacturer Part Number
TDA1519C
Description
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material
applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
M
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron
applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated
tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
7. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
2004 Jan 28
Through-hole mount CPGA, HCPGA
Through-hole-
surface mount
Surface mount
ANUAL SOLDERING
22 W BTL or 2  11 W
stereo power amplifier
from your NXP Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C  10 C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
MOUNTING
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
BGA, HTSSON..T
SSOP-T
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
(7)
(4)
, SO, SOJ
(5)
, TFBGA, USON, VFBGA
(11)
, PMFP
PACKAGE
(5)
, LBGA, LFBGA, SQFP,
(10)
, WQCCN32L
(1)
18
(11)
suitable
suitable
not suitable
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
(3)
WAVE
(6)
SOLDERING METHOD
(7)(8)
(9)
not suitable 
suitable
suitable
suitable
suitable
suitable
not suitable 
REFLOW
Product specification
TDA1519C
(2)
DIPPING
suitable