BAS101_BAS101S NXP Semiconductors, BAS101_BAS101S Datasheet
BAS101_BAS101S
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BAS101_BAS101S Summary of contents
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BAS101; BAS101S High-voltage switching diodes Rev. 02 — 14 December 2009 1. Product profile 1.1 General description High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device (SMD) plastic package. Table 1. Type number BAS101 BAS101S 1.2 Features High switching ...
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... Type number BAS101 BAS101S 4. Marking Table 5. Type number BAS101 BAS101S [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BAS101_BAS101S_2 Product data sheet Pinning Description anode not connected cathode anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) Ordering information Package ...
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... Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BAS101_BAS101S_2 Product data sheet Limiting values Parameter Conditions repetitive peak reverse voltage series connection reverse voltage series connection ...
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... Per diode V forward voltage F I reverse current R C diode capacitance d t reverse recovery time rr [1] Pulse test: t [2] When switched from I BAS101_BAS101S_2 Product data sheet Characteristics C unless otherwise specified. Conditions I = 100 250 250 MHz R ≤ 300 μs; δ ≤ 0.02. ...
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... I R (μ −1 10 − 120 V = 300 V R Fig 3. Reverse current as a function of junction temperature; typical values BAS101_BAS101S_2 Product data sheet mhc618 FSM ( (3) − 1.5 V (V) F Based on square wave currents T Fig 2. ...
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... Package outline SOT23 (TO-236AB) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS101 BAS101S [1] For further information and the availability of packing methods, see BAS101_BAS101S_2 Product data sheet SAMPLING OSCILLOSCOPE Ω R ...
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... NXP Semiconductors 11. Soldering Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BAS101_BAS101S_2 Product data sheet 2.90 2. 0.85 1.30 3.00 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 1.20 3 2.80 4.50 Rev. 02 — 14 December 2009 BAS101; BAS101S High-voltage switching diodes solder lands solder resist occupied area 2 ...
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... NXP Semiconductors 12. Mounting PCB thickness = 1.6 mm Fig 9. FR4 PCB, standard footprint SOT23 (TO-236AB) BAS101_BAS101S_2 Product data sheet BAS101; BAS101S 43.4 0.7 0.6 0.6 0.7 Dimensions in mm Rev. 02 — 14 December 2009 High-voltage switching diodes 40 0.5 006aaa527 © NXP B.V. 2009. All rights reserved ...
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... Table 3 BAS101_BAS101S_1 20060908 BAS101_BAS101S_2 Product data sheet Data sheet status Change notice Product data sheet - “Pinning”: updated Product data sheet - Rev. 02 — 14 December 2009 BAS101; BAS101S High-voltage switching diodes Supersedes BAS101_BAS101S_1 - © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 15. Contact information For more information, please visit: For sales office addresses, please send an email to: BAS101_BAS101S_2 Product data sheet [3] Definition This document contains data from the objective specification for product development. ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 December 2009 Document identifier: BAS101_BAS101S_2 All rights reserved. ...