LPC11U14FET48 NXP Semiconductors, LPC11U14FET48 Datasheet - Page 62
![The LPC11U14FET48 is a ARM Cortex-M0 based, low-cost 32-bit MCU, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/](/photos/41/52/415293/sot1155-2_3d_sml.gif)
LPC11U14FET48
Manufacturer Part Number
LPC11U14FET48
Description
The LPC11U14FET48 is a ARM Cortex-M0 based, low-cost 32-bit MCU, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/
Manufacturer
NXP Semiconductors
Datasheet
1.LPC11U12FBD48.pdf
(69 pages)
Available stocks
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Company:
Part Number:
LPC11U14FET48/201,
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
LPC11U1X
Product data sheet
Fig 36. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 2 — 11 January 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
LPC11U1x
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
62 of 69
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