LPC1759FBD80 NXP Semiconductors, LPC1759FBD80 Datasheet - Page 38

The LPC1759 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz

LPC1759FBD80

Manufacturer Part Number
LPC1759FBD80
Description
The LPC1759 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz
Manufacturer
NXP Semiconductors
Datasheet

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9. Thermal characteristics
Table 5.
V
LPC1759_58_56_54_52_51
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
=
T
R
P
40
amb
D
th(j-a)
T
amb
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
= the package junction-to-ambient thermal resistance (C/W)
+
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
C unless otherwise specified;
R
th j a
Rev. 7 — 29 March 2011
LPC1759/58/56/54/52/51
J
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
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C
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