LPC1857_53 NXP Semiconductors, LPC1857_53 Datasheet - Page 122
LPC1857_53
Manufacturer Part Number
LPC1857_53
Description
The LPC1857/53 are ARM Cortex-M3 based microcontrollers for embedded applications
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1853FBD208.pdf
(131 pages)
NXP Semiconductors
15. Soldering
LPC1857_53
Objective data sheet
Fig 38. Reflow soldering for the LBGA256 package
Footprint information for reflow soldering of LBGA256 package
DIMENSIONS in mm
1.00
P
0.450
SL
0.450
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.600
SR
P
17.500 17.500
Hx
Refer to the package outline drawing for actual layout
Hy
All information provided in this document is subject to legal disclaimers.
P
Rev. 1 — 14 December 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC1857/53
© NXP B.V. 2011. All rights reserved.
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