LPC1857_53 NXP Semiconductors, LPC1857_53 Datasheet - Page 4
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
LPC1857_53
Manufacturer Part Number
LPC1857_53
Description
The LPC1857/53 are ARM Cortex-M3 based microcontrollers for embedded applications
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1853FBD208.pdf
(131 pages)
- Current page: 4 of 131
- Download datasheet (2Mb)
NXP Semiconductors
4. Ordering information
Table 1.
Table 2.
LPC1857_53
Objective data sheet
Type number
LPC1857FET256
LPC1857FET180
LPC1857FBD208 LQFP208
LPC1853FET256
LPC1853FET180
LPC1853FBD208 LQFP208
Type number
LPC1857FET256
LPC1857FET180
LPC1857FBD208
LPC1853FET256
LPC1853FET180
LPC1853FBD208
Ordering information
Ordering options
4.1 Ordering options
Package
Name
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
Flash
1 MB
1 MB
1 MB
512 kB
512 kB
512 kB
Flash
bank A
512 kB
512 kB
512 kB
256 kB
256 kB
256 kB
Description
Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm
Plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm
Plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
All information provided in this document is subject to legal disclaimers.
Flash
bank B
512 kB
512 kB
512 kB
256 kB
256 kB
256 kB
Rev. 1 — 14 December 2011
Total
SRAM
136 kB
136 kB
136 kB
136 kB
136 kB
136 kB
LCD
yes
yes
yes
yes
yes
yes
Ethernet
yes
yes
yes
yes
yes
yes
32-bit ARM Cortex-M3 microcontroller
USB0
(Host,
Device,
OTG)
yes
yes
yes
yes
yes
yes
USB1
(Host,
Device)/
ULPI
interface
yes/yes
yes/yes
yes/yes
yes/yes
yes/yes
yes/yes
LPC1857/53
© NXP B.V. 2011. All rights reserved.
ADC
channels
8
8
8
8
8
8
Version
SOT740-2
SOT570-3
SOT459-1
SOT740-2
SOT570-3
SOT459-1
4 of 131
GPIO
164
118
142
164
118
142
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