LPC2387FBD100 NXP Semiconductors, LPC2387FBD100 Datasheet - Page 13

• Manufacturer Part Number: LPC2387FBD100
• Description: The LPC2387 is an ARM7 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 72 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 3.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Pad provides special analog functionality.
[11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
[12] If the RTC is not used, these pins can be left floating.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
[15] Pad provides special analog functionality.
[16] Pad provides special analog functionality.
[17] Pad provides special analog functionality.
LPC2387
Product data sheet
Symbol
V
V
V
V
V
VREF
VBAT
SS
SSA
DD(3V3)
DD(DCDC)(3V3)
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O pad, compatible with I
output functionality. When power is switched off, this pin connected to the I
Open-drain configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis
This pin has no built-in pull-up and no built-in pull-down resistor.
This pin has a built-in pull-up resistor.
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
Pin description
Pin
15, 31,
41, 55,
72, 97,
83
11
28, 54,
71, 96
13, 42,
84
10
12
19
[14]
[13]
[16]
[17]
[17]
[17]
…continued
[15]
Type
I
I
I
I
I
I
I
All information provided in this document is subject to legal disclaimers.
Description
ground: 0 V reference.
analog ground: 0 V reference. This should nominally be the same voltage as
V
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
3.3 V DC-to-DC converter supply voltage: This is the supply voltage for the
on-chip DC-to-DC converter only.
analog 3.3 V pad supply voltage: This should be nominally the same voltage
as V
used to power the ADC and DAC.
ADC reference: This should be nominally the same voltage as V
should be isolated to minimize noise and error. Level on this pin is used as a
reference for ADC and DAC.
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
SS
, but should be isolated to minimize noise and error.
DD(3V3)
Rev. 5 — 9 January 2012
2
but should be isolated to minimize noise and error. This voltage is
C-bus 400 kHz specification. This pad requires an external pull-up to provide
2
C-bus is floating and does not disturb the I
Single-chip 16-bit/32-bit MCU
LPC2387
© NXP B.V. 2012. All rights reserved.
DD(3V3)
2
C lines.
but
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