STPS20L15 STMicroelectronics, STPS20L15 Datasheet

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STPS20L15

Manufacturer Part Number
STPS20L15
Description
Low Drop OR-Ing Power Schottky Rectifier
Manufacturer
STMicroelectronics
Datasheet

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FEATURES AND BENEFITS
n
n
n
* :
THERMAL RESISTANCES
MAIN PRODUCT CHARACTERISTICS
DESCRIPTION
Packaged in TO-220AC or D
especially intended for use as an OR-ing diode in
fault tolerant power supply equipments.
ABSOLUTE RATINGS (limiting values)
July 2003 - Ed: 3B
Symbol
Symbol
I
R
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK SIZE
REVERSE VOLTAGE SUITED TO OR-ing OF 3V,
5V and 12V RAILS
AVALANCHE CAPABILITY SPECIFIED
V
F(RMS)
P
dV/dt
I
I
I
I
F(AV)
T
dPtot
RRM
th (j-c)
RSM
FSM
RRM
ARM
Tj
dTj
stg
V
Tj (max)
F
V
I
F(AV)
(max)
®
RRM
Repetitive peak reverse voltage
RMS forward current
Average forward current
Surge non repetitive forward current
Repetitive peak reverse current
Non repetitive peak reverse current
Repetitive peak avalanche power
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
Junction to case
Rth j
(
1
a
)
LOW DROP OR-ing POWER SCHOTTKY DIODE
thermal runaway condition for a diode on its own heatsink
2
PAK, this device is
125°C
0.33 V
20 A
15 V
Parameter
Parameter
Tc = 115°C
tp = 10 ms Sinusoidal
tp = 2 µs F = 1kHz
tp = 100 µs
tp = 1µs Tj = 25°C
K
STPS20L15D
TO-220AC
= 1
STPS20L15D/G
K
A
- 65 to + 150
Value
1.6
STPS20L15G
13500
10000
Value
310
125
K
15
30
20
2
3
D
2
PAK
NC
°C/W
Unit
Unit
V/µs
A
°C
°C
W
V
A
A
A
A
A
1/5

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STPS20L15 Summary of contents

Page 1

... V K PAK, this device is Parameter Tc = 115° Sinusoidal µ 1kHz tp = 100 µ 1µ 25°C Parameter STPS20L15D TO-220AC D STPS20L15D STPS20L15G Value 310 2 3 13500 - 150 125 10000 Value 1 PAK Unit ...

Page 2

... STPS20L15D/G STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions I * Reverse leakage R current V * Forward voltage drop F Pulse test : * tp = 380 s, < evaluate the maximum conduction losses use the following equation : - 0. 8. F(AV) F (RMS) Fig. 1: Average forward power dissipation versus average forward current. ...

Page 3

... IFM(A) 200.0 100.0 Tj=125°C 10.0 Tj=75°C Tj=25°C 1.0 VFM(V) 0.1 0 0.2 0.4 0.6 0.8 Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 m). (STPS20L15G only) Rth(j-a) (°C/ S(Cu) (cm² Fig ...

Page 4

... STPS20L15D/G PACKAGE MECHANICAL DATA 2 D PAK FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 8.90 4/5 REF 5.08 1.30 3.70 DIMENSIONS Millimeters Inches Min. Max. Min. 4.40 4.60 0.173 2.49 2.69 0.098 0.03 0.23 0.001 ...

Page 5

... Ordering type Marking STPS20L15D STPS20L15D STPS20L15G STPS20L15G STPS20L15G-TR STPS20L15G Cooling method: by conduction (C) n Recommended torque value: 0.55 m.N n Maximum torque value: 0.7 m.N n Epoxy meets UL94,V0 n Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics ...

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