STM32F102RB STMicroelectronics, STM32F102RB Datasheet



Manufacturer Part Number
Mainstream USB Access line, ARM Cortex-M3 MCU with 128 Kbytes Flash, 48 MHz CPU, USB FS

Specifications of STM32F102RB

ARM 32-bit Cortex™-M3 CPU
Peripherals Supported
timers, ADC, SPIs, I2Cs and USARTs
Conversion Range
0 to 3.6 V
Systick Timer
24-bit downcounter

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Part Number
Part Number:
Part Number:
10 000
Part Number:
Medium-density USB access line, ARM-based 32-bit MCU with 64/128KB
September 2009
Flash, USB FS interface, 6 timers, ADC & 8 communication interfaces
Core: ARM 32-bit Cortex™-M3 CPU
– 48 MHz maximum frequency,
– Single-cycle multiplication and hardware
– 64 or 128 Kbytes of Flash memory
– 10 or 16 Kbytes of SRAM
Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR and programmable voltage
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration
Low power
– Sleep, Stop and Standby modes
– V
Debug mode
– Serial wire debug (SWD) and JTAG
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
1 × 12-bit, 1.2 µs A/D converter (up to 16
– Conversion range: 0 to 3.6 V
– Temperature sensor
Up to 51 fast I/O ports
– 37/51 IOs all mappable on 16 external
1.25 DMIPS/MHz (Dhrystone 2.1)
performance at 0 WS memory access
detector (PVD)
interrupt vectors and almost all 5 V-tolerant
Cs and USARTs
supply for RTC and backup registers
Doc ID 15056 Rev 3
Table 1.
Up to 6 timers
– Three 16-bit timers, each with up to 4
– 2 watchdog timers (Independent and
– SysTick timer: 24-bit downcounter
Up to 8 communication interfaces
– Up to 2 x I
– Up to 3 USARTs (ISO 7816 interface, LIN,
– Up to 2 SPIs (12 Mbit/s)
– USB 2.0 full speed interface
CRC calculation unit, 96-bit unique ID
IC/OC/PWM or pulse counter
IrDA capability, modem control)
10 × 10 mm
Device summary
C interfaces (SMBus/PMBus)
STM32F102C8, STM32F102R8
STM32F102CB, STM32F102RB
Part number
7 × 7 mm

Related parts for STM32F102RB

STM32F102RB Summary of contents

Page 1

... SPIs (12 Mbit/s) – USB 2.0 full speed interface ■ CRC calculation unit, 96-bit unique ID ® ■ ECOPACK packages Table 1. Device summary Reference STM32F102x8 STM32F102C8, STM32F102R8 STM32F102xB STM32F102CB, STM32F102RB Doc ID 15056 Rev 3 STM32F102x8 STM32F102xB LQFP48 7 × Part number 1/69 1 ...

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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32F102x8, STM32F102xB 5.3.13 5.3.14 5.3.15 5.3.16 5.3.17 6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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List of tables List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32F102x8, STM32F102xB Table 45. R max for f AIN ADC Table 46. ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . ...

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List of figures List of figures Figure 1. STM32F102xx medium-density USB access line block diagram . . . . . . . . . . . . . . . . . . . . 10 Figure 2. Clock tree ...

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... This datasheet provides the ordering information and mechanical device characteristics of the STM32F102x4 and STM32F102x6 medium-density USB access line microcontrollers. For more details on the whole STMicroelectronics STM32F102xx family, please refer to Section 2.2: Full compatibility throughout the The medium-density STM32F102xx datasheet should be read in conjunction with the low-, medium- and high-density STM32F10xxx reference manual ...

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Description 2 Description The STM32F102xx medium-density USB access line incorporates the high-performance ARM Cortex™-M3 32-bit RISC core operating MHz frequency, high-speed embedded memories (Flash memory 128 Kbytes and SRAM Kbytes), ...

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STM32F102x8, STM32F102xB 2.1 Device overview Table 2. STM32F102x8 and STM32F102xB medium-density USB access line features and peripheral counts Peripheral Flash - Kbytes SRAM - Kbytes Timers Communication interfaces 12-bit synchronized ADC number of channels GPIOs CPU frequency Operating voltage Operating ...

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Description Figure 1. STM32F102xx medium-density USB access line block diagram TRACECLK TRACED[0: JNTRST JTDI JTCK/SWCLK JTMS/SWDIO JTDO as AF NRST VDDA VSSA 51AF PA[ 15:1] PB[ 15:0] PC[15:0] PD[2:0] MOSI,MISO, SCK,NSS as AF RX,TX, CTS, RTS, Smart Card ...

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STM32F102x8, STM32F102xB Figure 2. Clock tree OSC_OUT 4-16 MHz HSE OSC OSC_IN OSC32_IN LSE OSC 32.768 kHz OSC32_OUT Main Clock Output MCO 1. For the USB function to be available, both HSE and PLL must be enabled, with the CPU ...

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Description 2.2 Full compatibility throughout the family The STM32F102xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F102x4 and STM32F102x6 are referred to as low-density devices and the STM32F102x8 and ...

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STM32F102x8, STM32F102xB CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used to ...

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Description Boot modes At startup, boot pins are used to select one of five boot options: ● Boot from User Flash ● Boot from System Memory ● Boot from embedded SRAM The boot loader is located in System Memory. It ...

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STM32F102x8, STM32F102xB Low-power modes The STM32F102xx medium-density USB access line supports three low-power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: ● Sleep mode In Sleep mode, only the CPU is ...

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Description register to generate an alarm. A 20-bit prescaler is used for the time base clock and is by default configured to generate a time base of 1 second from a clock at 32.768 kHz. Independent watchdog The independent watchdog ...

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STM32F102x8, STM32F102xB Universal synchronous/asynchronous receiver transmitter (USART) The available USART interfaces communicate 2.25 Mbit/s. They provide hardware management of the CTS and RTS signals, support IrDA SIR ENDEC, are ISO 7816 compliant and have LIN Master/Slave capability. ...

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Pinouts and pin description 3 Pinouts and pin description Figure 3. STM32F102xx medium-density USB access line LQFP48 pinout PC13-TAMPER-RTC PC15-OSC32_OUT Figure 4. STM32F102xx medium-density USB access line LQFP64 pinout PC13-TAMPER-RTC PC15-OSC32_OUT 18/ ...

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STM32F102x8, STM32F102xB Table 4. Medium-density STM32F102xx pin definitions Pins Pin name BAT 2 2 PC13-TAMPER-RTC 3 3 PC14-OSC32_IN 4 4 PC15-OSC32_OUT 5 5 PD0 6 6 PD1 7 7 NRST - 8 PC0 - 9 PC1 - ...

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Pinouts and pin description Table 4. Medium-density STM32F102xx pin definitions (continued) Pins Pin name 21 29 PB10 22 30 PB11 SS_1 DD_1 25 33 PB12 26 34 PB13 27 35 PB14 28 36 PB15 ...

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... The use of PD0 and PD1 in output mode is limited as they can only be used at 50 MHz in output mode. 8. This alternate function can be remapped by software to some other port pins (if available on the used package). For more details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, available from the STMicroelectronics website: Main (3) ...

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Memory mapping 4 Memory mapping The memory map is shown in Figure 5. Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex-M3 internal peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 Peripherals 0x4000 ...

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STM32F102x8, STM32F102xB 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referred to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

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Electrical characteristics Figure 6. Pin loading conditions 5.1.6 Power supply scheme Figure 8. Power supply scheme 1.8-3 × 100 × 4.7 µ µF Caution: In ...

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STM32F102x8, STM32F102xB 5.1.7 Current consumption measurement Figure 9. Current consumption measurement scheme 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 6: Current characteristics, and damage to the device. These are stress ratings only and functional ...

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Electrical characteristics Table 6. Current characteristics Symbol I Total current into V VDD I Total current out of V VSS Output current sunk by any I/O and control pin I IO Output current source by any I/Os and control pin ...

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STM32F102x8, STM32F102xB 5.3 Operating conditions 5.3.1 General operating conditions Table 8. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock frequency PCLK2 V Standard operating voltage DD Analog operating ...

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Electrical characteristics 5.3.3 Embedded reset and power control block characteristics The parameters given in temperature and V . Table 10. Embedded reset and power control block characteristics Symbol Programmable voltage V PVD detector level selection (2) V PVD hysteresis PVDhyst ...

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STM32F102x8, STM32F102xB Table 11. Embedded internal reference voltage Symbol V Internal reference voltage REFINT ADC sampling time when reading (1) T S_vrefint the internal reference voltage Internal reference voltage spread (2) V RERINT over the temperature range (2) T Temperature ...

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Electrical characteristics Table 12. Maximum current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply current Run mode 1. Based on characterization results, not tested in production. 2. External clock is 8 ...

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STM32F102x8, STM32F102xB Figure 10. Typical current consumption in Run mode versus temperature (at 3 code with data processing running from RAM, peripherals enabled Figure 11. Typical current consumption in Run mode ...

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Electrical characteristics Table 14. Maximum current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply current Sleep mode 1. Based on characterization, tested in production External clock is 8 MHz ...

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STM32F102x8, STM32F102xB Figure 12. Typical current consumption values BAT 2.5 2 1.5 1 0.5 0 Figure 13. Typical current consumption in Stop mode with regulator in Run mode versus temperature at V 140 120 100 80 60 ...

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Electrical characteristics Figure 14. Typical current consumption in Stop mode with regulator in Low-power mode versus temperature at V 140 120 100 -40 Figure 15. Typical current consumption in Standby mode versus temperature at V ...

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STM32F102x8, STM32F102xB Typical current consumption The MCU is placed under the following conditions: ● All I/O pins are in input mode with a static value at V ● All peripherals are disabled except explicitly mentioned ● The ...

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Electrical characteristics Table 17. Typical current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply IDD current in Sleep mode 1. Typical values are measures Add an additional power consumption of 0.8 mA ...

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STM32F102x8, STM32F102xB On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in under the following conditions: ● all I/O pins are in input mode with a static value at V ● all peripherals are disabled unless ...

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Electrical characteristics 5.3.6 External clock source characteristics High-speed external user clock generated from an external source The characteristics given in external clock source, and under ambient temperature and supply voltage conditions summarized in Table Table 19. High-speed external user clock ...

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STM32F102x8, STM32F102xB Figure 16. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) External clock source Figure 17. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t r(LSE) External ...

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Electrical characteristics High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained ...

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STM32F102x8, STM32F102xB Figure 18. Typical application with an 8 MHz crystal integrated capacitors 1. R value depends on the crystal characteristics. EXT Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a ...

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Electrical characteristics Caution: To avoid exceeding the maximum value use a resonator with a load capacitance C capacitance of 12.5 pF. Example: if you choose a resonator with a load capacitance of C then ...

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STM32F102x8, STM32F102xB low-speed internal (LSI) RC oscillator Table 24. LSI oscillator characteristics Symbol f Frequency LSI (3) t LSI oscillator startup time su(LSI) (3) I LSI oscillator power consumption DD(LSI) =  °C unless otherwise specified ...

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Electrical characteristics Table 26. PLL characteristics (continued) Symbol t PLL lock time LOCK Jitter Cycle-to-cycle jitter 1. Based on characterization, not tested in production. 2. Take care of using the appropriate multiplier factors have PLL input clock ...

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STM32F102x8, STM32F102xB Functional EMS (Electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: ...

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Electrical characteristics Table 30. EMI characteristics Symbol Parameter S Peak level EMI 5.3.11 Absolute maximum ratings (electrical sensitivity) Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in ...

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STM32F102x8, STM32F102xB 5.3.12 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 33. I/O static characteristics Symbol V Input low level voltage IL Standard IO input high level ...

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Electrical characteristics Output driving current The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink +20 mA (with a relaxed V In the user application, the number of I/O pins which can drive current must ...

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STM32F102x8, STM32F102xB Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 35, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 8. Table 35. I/O AC characteristics MODEx ...

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Electrical characteristics Figure 20. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved 2/3)T and if the duty cycle is (45-55%) 5.3.13 NRST pin characteristics The NRST pin input ...

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STM32F102x8, STM32F102xB 5.3.14 TIM timer characteristics The parameters given in Refer to Section 5.3.12: I/O port characteristics function characteristics (output compare, input capture, external clock, PWM output). Table 37. TIMx Symbol t Timer resolution time res(TIM) Timer external clock f ...

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Electrical characteristics 2 Table 38 characteristics Symbol t SCL clock low time w(SCLL) t SCL clock high time w(SCLH) t SDA setup time su(SDA) t SDA data hold time h(SDA) t r(SDA) SDA and SCL rise time t ...

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STM32F102x8, STM32F102xB 2 Figure 22 bus AC waveforms and measurement circuit I²C bus S TART SDA t f(SDA) t h(STA) SCL t w(SCKH) 1. Measurement points are done at CMOS levels: 0.3V Table 39. SCL frequency (f 1. ...

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Electrical characteristics SPI interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table Refer to Section 5.3.12: I/O port characteristics function characteristics (NSS, SCK, MOSI, MISO). Table 40. SPI characteristics Symbol f SCK ...

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STM32F102x8, STM32F102xB Figure 23. SPI timing diagram - slave mode and CPHA=0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure 24. SPI ...

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Electrical characteristics Figure 25. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: 0.3V USB ...

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STM32F102x8, STM32F102xB Table 42. USB DC electrical characteristics Symbol V USB operating voltage DD (4) V Differential input sensitivity Input DI levels (4) V Differential common mode range CM (4) V Single ended receiver threshold SE V Static output level ...

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Electrical characteristics Table 44. ADC characteristics Symbol V Power supply DDA f ADC clock frequency ADC (1) Sampling rate f S (1) External trigger frequency f TRIG V Conversion voltage range AIN (1) R External input impedance AIN (1) Sampling ...

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STM32F102x8, STM32F102xB Table 45. R AIN T (cycles) s 1.5 7.5 13.5 28.5 41.5 55.5 71.5 239.5 1. Data guaranteed by design, not tested in production. Table 46. ADC accuracy - limited test conditions Symbol ET Total unadjusted error EO ...

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Electrical characteristics Figure 27. ADC accuracy characteristics [1LSB = IDEAL 4095 4094 4093 SSA Figure 28. Typical connection diagram using the ADC R AIN (1) V AIN ...

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STM32F102x8, STM32F102xB General PCB design guidelines Power supply decoupling should be performed as shown in should be ceramic (good quality). They should be placed as close as possible to the chip. Figure 29. Power supply and reference decoupling 5.3.17 Temperature ...

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Package characteristics 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...

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STM32F102x8, STM32F102xB Figure 30. LQFP64 – mm, 64 pin low-profile quad flat package outline Drawing is not to scale. 2. Dimensions are in millimeters. Table 49. LQFP64 – mm, ...

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Package characteristics Figure 32. LQFP48 – mm, 48-pin low-profile quad flat package outline Seating plane ccc Pin 1 1 identification 1. Drawing is not to ...

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STM32F102x8, STM32F102xB 6.2 Thermal characteristics The maximum chip junction temperature (T Table 8: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in C, ●  ...

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Package characteristics 6.3.1 Evaluating the maximum junction temperature for an application When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum ...

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STM32F102x8, STM32F102xB 7 Ordering information scheme Table 52. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = general-purpose Device subfamily 102 = USB access line, USB 2.0 full-speed interface Pin count ...

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Revision history 8 Revision history Table 53. Document revision history Date Revision 23-Sep-2008 23-Apr-2009 22-Sep-2009 68/69 1 Initial release. I/O information clarified on page density USB access line block diagram modified. In Table 4: Medium-density STM32F102xx pin PB14, PB15, PB3/TRACESWO ...

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... STM32F102x8, STM32F102xB Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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