STM32F100VD STMicroelectronics, STM32F100VD Datasheet - Page 92
STM32F100VD
Manufacturer Part Number
STM32F100VD
Description
Mainstream Value line, ARM Cortex-M3 MCU with 384 Kbytes Flash, 24 MHz CPU, motor control and CEC functions
Manufacturer
STMicroelectronics
Datasheet
1.STM32F100ZC.pdf
(97 pages)
Specifications of STM32F100VD
Peripherals Supported
timers, ADC, SPIs, I2Cs, USARTs and DACs
Conversion Range
0 to 3.6 V
One 16-bit, 6-channel Advanced-control Timer
up to 6 channels for PWM output, dead time generation and emergency stop
Systick Timer
24-bit downcounter
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Package characteristics
6.2
6.2.1
92/97
Thermal characteristics
The maximum chip junction temperature (T
Table 9: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 60.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP 144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 64 - 10 × 10 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
Doc ID 15081 Rev 5
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
STM32F100xC, STM32F100xD, STM32F100xE
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
37.
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Value
35
40
49
max + P
I/O
max),
°C/W
Unit