STM8AF52AA STMicroelectronics, STM8AF52AA Datasheet - Page 103

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STM8AF52AA

Manufacturer Part Number
STM8AF52AA
Description
STM8AF52 CAN Line
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM8AF52AA

Max Fcpu
24 MHz
Program Memory
32 to 128 Kbytes Flash program; data retention 20 years at 55 °C
Data Memory
up to 2 Kbytes true data EEPROM; endurance 300 kcycles
Ram
2 Kbytes to 6 Kbytes
Advanced Control Timer
16-bit, 4 CAPCOM channels, 3 complementary outputs, dead-time insertion and flexible synchronization

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STM8AF52/62xx, STM8AF51/61xx
Table 55.
13-Apr-2010
08-Jul-2010
Date
Document revision history (continued)
Revision
Rev 6
Rev 7
Updated title on cover page.
Modified cover page header to clarify the part numbers covered by
the datasheets. Updated
add ‘P’ order codes.
Changed definition of ‘P’ order codes.
‘Q’ order codes (FASTROM and EEPROM) removed.
Content of
STM8A microcontroller family pin
alternate function, removed caution note for PD6/ LINUART_RX, and
added
Renamed
with section 9. Register map. Updated
memory
Renamed BL_EN and NBL_EN, BL and NBL, respectively, in
Table 19: Option
Updated AFR4 definition in
C
VCAP external
Update t
down.
Moved
to
Removed V
Updated
by the datasheet.
Updated
Added STM8AF5168 and STM8AF518A part number in
and STM8AF618A in
STM8AF628x, and STM8AF62Ax.
Updated D temperature range to -40 to 150°C.
Updated number of I/Os on cover page.
Added
Restored V
Table 25: General operating
ESL parameter, and range D maximum junction temperature (T
Added STM8AF52xx and STM8AF62xx, and
Ordering
Updated
Product evolution
communication mode limitation into
Section
Doc ID 14395 Rev 8
EXT
Section : Current consumption for on-chip
in
Note 1
Table 24: Operating
Table 31: Typical peripheral current consumption V
Table 25: General operating
13.7.4.
VDD
map.
Section 12: Ordering information
Section 13: STM8 development
Section 13: STM8 development
information.
Section 7 Memory and register
Section 5: Product overview
ESD(MM)
ESD(MM)
in
to PA1/OSCIN.
capacitor.
Table 26: Operating conditions at power-up/power-
bytes.
summary, and split the beCAN time triggered
from
from
Figure
Table 48: ESD absolute maximum
Note 1
Table 48: ESD absolute maximum
lifetime.
Table 20: Option byte
conditions: updated V
5. Added STM8AF52xx, STM8AF6269,
Changes
below
description: updated PD7/TLI
Section 13.7.3
conditions, and
Figure 7: Register and
Table 1: Device summary
reorganized.
tools.
tools: added
map, and content merged
to the devices supported
peripherals.
Note 3
description.Added
Revision history
CAP
and
Section 10.3.1:
in
Table 12:
Table 54:
information.
Section 12:
Figure
DD
ratings.
ratings.
= 5.0 V
103/106
J
4,
).
to

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