CGY888C,112 NXP Semiconductors, CGY888C,112 Datasheet
CGY888C,112
Specifications of CGY888C,112
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CGY888C,112 Summary of contents
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CGY888C 34 dB, 870 MHz GaAs push-pull forward amplifier Rev. 4 — 28 September 2010 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage (DC), employing Hetero junction ...
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... NXP Semiconductors 1.4 Quick reference data Table 1. Bandwidth to 870 MHz; V Symbol tot [1] Direct Current (DC). 2. Pinning information Table 2. Pin Ordering information Table 3. Type number CGY888C 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter i(RF) ...
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... NXP Semiconductors 5. Characteristics Table 5. Characteristics Bandwidth to 870 MHz (DC Symbol Parameter G power gain p SL slope straight line sl FL flatness of frequency response CTB composite triple beat CSO composite second-order distortion Xmod cross modulation RL input return loss in RL output return loss out NF noise figure ...
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... NXP Semiconductors 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 0.38 OUTLINE VERSION IEC SOT115J Fig 1 ...
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... NXP Semiconductors 7. Abbreviations Table 6. Acronym CATV DC GaAs MMIC NTSC PAL RF UNC 8. Revision history Table 7. Revision history Document ID Release date CGY888C v.4 20100928 • Modifications: Package outline drawings have been updated to the latest version. • Legal texts have been updated. CGY888C v.3 20091014 CGY888C v ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Legal information 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 9 ...