AP4511GD Advanced Power Electronics Corp., AP4511GD Datasheet - Page 3

Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching,ruggedized device design, ultra low on-resistance and cost-effectiveness

AP4511GD

Manufacturer Part Number
AP4511GD
Description
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching,ruggedized device design, ultra low on-resistance and cost-effectiveness
Manufacturer
Advanced Power Electronics Corp.
Datasheet

Specifications of AP4511GD

Vds
35V
Vgs
±20V
Rds(on) / Max(m?) Vgs@10v
25
Rds(on) / Max(m?) Vgs@4.5v
37
Qg (nc)
11
Qgs (nc)
3
Qgd (nc)
6
Id(a)
7
Pd(w)
2
Configuration
Complementary N-P
Package
PDIP-8
ΔBV
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
BV
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
R
V
t
Q
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in
P-CH Electrical Characteristics@T
Source-Drain Diode
DSS
GSS
d(on)
r
d(off)
f
rr
fs
GS(th)
SD
DS(ON)
iss
oss
rss
g
g
gs
gd
rr
DSS
Symbol
Symbol
DSS
/ΔT
j
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
Static Drain-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Drain-Source Leakage Current (T
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
2
copper pad of FR4 board , t <10sec ; 90℃/W when mounted on min. copper pad.
Parameter
Parameter
2
2
2
2
j
=70
o
C)
2
j
=25
V
Reference to 25℃,I
V
V
V
V
V
V
V
I
V
V
V
I
R
R
V
V
f=1.0MHz
f=1.0MHz
I
I
dI/dt=-100A/µs
D
D
S
S
GS
GS
GS
DS
DS
DS
DS
GS
DS
GS
DS
GS
DS
=-1.7A, V
=-6A, V
=-6A
=-1A
G
D
o
=18Ω
=3.3Ω,V
=0V, I
=-10V, I
=-4.5V, I
=V
=-10V, I
=-35V, V
=-28V, V
=±20V
=-28V
=-4.5V
=-18V
=0V
=-25V
C(unless otherwise specified)
GS
Test Conditions
Test Conditions
, I
GS
D
D
=-250uA
GS
=0V
=-250uA
D
D
GS
D
GS
GS
=-6A
=-6A
=0V
=-4A
=-10V
=0V
=0V
D
=-1mA
Min.
Min.
-35
-1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-0.02
Typ.
Typ.
690
165
130
5.2
35
53
10
10
26
20
12
AP4511GD
9
2
6
6
7
-
-
-
-
-
-
±100
1100
Max. Units
Max. Units
-1.2
-25
7.8
40
60
16
-3
-1
-
-
-
-
-
-
-
-
-
-
-
-
-
V/℃
nC
nC
nC
nC
uA
uA
nA
pF
pF
pF
ns
ns
ns
ns
Ω
ns
V
V
S
V
3

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