IR3086AMTR International Rectifier, IR3086AMTR Datasheet - Page 32
IR3086AMTR
Manufacturer Part Number
IR3086AMTR
Description
XPHASE Phase IC with OVP with fault overtemp detect. The IR3086AM Phase IC combined with an IR XPhase TM Control IC provides a full featured and flexible way to implement power solutions for the latest high performance CPUs and ASICs.
Manufacturer
International Rectifier
Datasheet
1.IR3086AM.pdf
(33 pages)
Specifications of IR3086AMTR
Package
20-Lead MLPQ
Circuit
X-Phase Phase IC
Iout (a)
2.5A Gate Driver
Pbf
PbF Option Available
Available stocks
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Stencil Design
The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit approximately
The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch
devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower; openings in
stencils < 0.25mm wide are difficult to maintain repeatable solder release.
land.
50% area of solder on the center pad. If too much solder is deposited on the center pad the part will float
and the lead lands will be open.
minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands
when the part is pushed into the solder paste.
Page 32 of 33
IR3086A
2/13/09