FDMS3008SDC Fairchild Semiconductor, FDMS3008SDC Datasheet - Page 3

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FDMS3008SDC

Manufacturer Part Number
FDMS3008SDC
Description
Manufacturer
Fairchild Semiconductor
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
FDMS3008SDC
Manufacturer:
Fairchild/ON Semiconductor
Quantity:
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Part Number:
FDMS3008SDC
Manufacturer:
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©2011 Fairchild Semiconductor Corporation
FDMS3008SDC Rev.C
Thermal Characteristics
NOTES:
1. R
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied.
5. I
R
R
R
R
R
R
R
R
R
R
R
R
R
R
by the user's board design.
θJC
θJC
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
SD
θJA
AS
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
≤ 28 A, di/dt ≤ 210 A/μs, V
of 112 mJ is based on starting T
is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
DD
≤ BV
J
DSS
= 25
2
, Starting T
pad of 2 oz copper
°
C, L = 1 mH, I
a. 38 °C/W when mounted on
a 1 in
J
2
= 25
pad of 2 oz copper
AS
o
2
C.
pad of 2 oz copper
= 15 A, V
2
pad of 2 oz copper
DD
= 27 V, V
GS
3
2
= 10 V. 100% test at L = 0.1 mH, I
pad of 2 oz copper
2
pad of 2 oz copper
(Bottom Drain)
(Top Source)
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1d)
(Note 1e)
(Note 1g)
(Note 1h)
(Note 1k)
(Note 1f)
(Note 1i)
(Note 1j)
(Note 1l)
θJC
AS
is guaranteed by design while R
= 33.4 A.
b. 81 °C/W when mounted on
a minimum pad of 2 oz copper
3.5
1.6
38
81
27
34
16
19
26
61
16
23
13
11
θCA
www.fairchildsemi.com
is determined
°C/W