TLE 7824G Infineon Technologies, TLE 7824G Datasheet

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TLE 7824G

Manufacturer Part Number
TLE 7824G
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of TLE 7824G

Packages
PG-DSO-28
Flash
24.0 kByte
Frequency (f)
24.0 MHz
High Side Switch
1
High Voltage Monitor Input
5
Gpio
8
D a t a S h e e t , R e v . 3 . 0 1 , A p r i l 2 0 0 8
T L E 7 8 2 4 G
I n t e g r a t e d d o u b l e l o w - s i d e s w i t c h , h i g h - s i d e / L E D
d r i v e r , h a l l s u p p l y , w a k e - u p i n p u t s a n d L I N
c o m m u n i c a t i o n w i t h e m b e d d e d M C U ( 2 4 k B F l a s h )
A u t o m o t i v e P o w e r

Related parts for TLE 7824G

TLE 7824G Summary of contents

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Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Integrated double low-side switch, high-side/LED driver, hall supply, wake-up inputs and LIN communication with embedded MCU (24kB Flash) 1 Overview Relay Driver - System Basis Chip • Low-Dropout Voltage Regulator (LDO) • LIN Transceiver • Standard 16-bit SPI-Interface 2 × ...

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Description This single-packaged solution incorporates an 8-bit state-of-the-art microcontroller compatible to the standard 8051 core with On-Chip Debug Support (OCDS), and a System-Basis-Chip (SBC). The SBC is equipped with LIN transceiver, low-dropout voltage regulator (LDO) as well as two low-side ...

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Block Diagram V bat Supply Output (Hall Sensor) Low-Side Switch 1 Low-Side Switch 2 5* Wake-Up Inputs 1* LED-Driver LIN-Bus * note: LED Driver and Wake-up input 5 share the same pin (MON5/HS_LED) Figure 1 Functional Block Diagram (Module ...

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Pin Definitions and Functions 1 MON3 2 MON4 3 MON5 / HS_LED 4 LIN 5 LS2 6 LS1 7 GND RESET 8 9 P0.3/SCLK_1/COUT63_1 10 P0.4/MTSR_1/CC62_1 P0.5/MRST_1/EXINT0_0/COUT62_1 11 GND DDC TMS 14 Figure 2 Pin Configuration ...

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Pin No. Symbol Function 4 LIN LIN Bus; Bus Line for the LIN interface, according to ISO 9141 and LIN specification 1.3 and 2.0 24 SUPPLY Supply Output; e.g. for Hall Sensor; controlled via SPI 5 LS2 Low Side Switch ...

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Pin No. Symbol Function V – ADC Measurement Output (analog); for chip temperature and battery voltage A measurement – ERR Error Pin; bi-directional signal; ERR has an internal pull-up; low-active; connected to µC General Purpose Input P3.6 (RSTOUT) 7 GND ...

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Operating Modes The TLE7824G incorporates several SBC operating modes, that are listed in Table 1 SBC Operating Modes Functional Block SBC Standby Mode LDO ON CC Window Watchdog ON Monitoring / wake-up pins ON / ...

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Start Up Power Up SBC Stop Mode MS2 MS1 MS0 SBC Active Mode MS2 MS1 MS0 SBC Active Mode: „LIN Sleep“ MS2 MS1 MS0 Figure 4 State Diagram “SBC Operation Modes” ...

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SBC Active Mode “LIN Sleep” In SBC Active Mode “LIN Sleep” the SBC’s current consumption is reduced by disabling the LIN transceiver. This also means that the internal pull-up resistor of the LIN transceiver is turned off in SBC ...

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Power Saving Modes 4.5.1 SBC Sleep Mode During SBC Sleep Mode (see Figure regulator switched-off. As the microcontroller cannot be supplied, the integrated window watchdog can be disabled in Sleep Mode via a dedicated SPI control bit. However, it ...

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SBC Stop Mode The SBC Stop Mode has the advantage of reducing the current consumption to a minimum, while supplying the microcontroller with its quiescent current during its power saving mode (“Stop”). This mode is entered via SPI command, ...

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SBC Stop Mode with Cyclic Wake The SBC Stop Mode has the advantage of reducing the current consumption to a minimum, while supplying the microcontroller with its quiescent current during its power saving mode (“Stop”). This mode is entered ...

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LIN Transceiver The TLE7824G offers a LIN transceiver, which is compatible to ISO9141 and certified according to LIN Specification 1.3 and 2.0 “Physical Layer”. The transceiver has a pull-up resistor of 30 kΩ implemented and is protected against short ...

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ADC Measurement Interface The SBC measurement interface comprises a battery measurement unit (high voltage input chip temperature sensor. A multiplexer is used to select the desired input channel that is connected to the ADC of the μC. This multiplexer ...

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Further details on the implementation of the calibration function and location of the calibration figures in Flash memory can be found in a dedicated application note. The voltage measurement target parameters can be found in “ADC Battery Voltage Measurement Interface, ...

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Low Dropout Voltage Regulator The Low Drop-Out Voltage Regulator (LDO) has mainly been integrated in the TLE7824G in order to supply the integrated microcontroller and several modules of the SBC. Note: The LDO is not intended to be used ...

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SPI (Serial Peripheral Interface) Control and status information between SBC and μC is exchanged via a digital interface, that is called “serial peripheral interface” (SPI) on the SBC side, and “synchronous serial channel” (SSC) on the μC side. The ...

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Table 2 SPI Input Data Bits BIT Input Data 0 Mode Selection Bit 0 (MS0) 1 Mode Selection Bit 1 (MS1) 2 Mode Selection Bit 2 (MS2) 3 Configuration Selection Bit 0 (CS0) 4 Configuration Selection Bit 1 (CS1) 5 ...

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Table 5 General & Integrated Switch Configuration Pos. General Configuration 5 Reset Threshold: “default” or “SPI option” (see Table 14: Reset Generator; Pin 6 Reset Delay: “default” or “SPI option” (see Table 14: Reset Generator; Pin 7 LIN “Low Slope ...

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Table 7 Cyclic Wake Period Settings (Stop Mode only … … … Table ...

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Table 9 SPI Output Data (cont’d) 1) Pos. Output Data 14 Supply Output ( [only “SBC Active Mode” “1” enable, “0” = OFF / disable overcurrent, UV ...

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Table 10 Diagnostic, Protection and Safety Functions (cont’d) Module Function HS-LED OC -UV BAT V -OV BAT V V -Monitor -UV BAT BAT V (at pin) BAT_SENSE V -OV BAT V V -Monitor - LIN LIN-Failure ...

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Reset Behavior and Window Watchdog The SBC provides three different resets: V • -UV: reset of SBC upon undervoltage detection at internal supply voltage INT V • -UV: reset of SBC upon undervoltage detection at supply voltage ( CC ...

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Monitoring / Wake-Up Inputs MON1 … 5 and Wake-Up Event Signalling In addition to a wake-up from SBC Stop / Sleep Mode via the LIN bus line it is also possible to wake-up the TLE7824G from low power mode ...

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I MON Figure 12 Monitoring Input Characteristics Data Sheet Monitoring / Wake-Up Inputs MON1 … 5 and Wake-Up Event Signalling V V MONth_min MONth_max Pull-down current Pull-up current 28 TLE7824G V MON Rev. 3.01, 2008-04-15 ...

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Low Side Switches The low side switches LS1 and LS2 have been designed to drive relays, e.g. in window lift applications. The continuous output current is dimensioned for 300mA (each) maximum. In SBC Active and LIN Receive-Only mode the ...

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Supply Output for Hall Sensor Supply The SUPPLY Output is intended to be used as Hall Sensor supply. In SBC Active and LIN Receive-Only mode this output can be switched on and off, respectively via an SPI input bit. ...

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High-Side Switch as LED Driver (HS-LED) The high side output HS_LED is intended for driving LEDs or small lamps. This function and the wake-up function via MON5 input are realized on the same pin (MON5/HS_LED). In SBC Active and ...

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General Purpose I/Os (GPIO) The pins P0.3 / P0.4 / P0.5 and P2.0 / P2.1 provide general purpose functionality, like Hall Sensor inputs, PWM output and capture. GPIOs P0.0, P0.1 and P0.2 are available in user mode only (alternate ...

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Error Interconnect (ERR) The ERR interconnect provides a bi-directional error signalization. The ERR output (active low) immediately signals that a low side switch LSx has been shut down due to overcurrent or overtemperature condition. If the ERR signal is ...

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General Product Characteristics 16.1 Absolute Maximum Ratings Table 12 Absolute Maximum Ratings = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin T j (unless otherwise specified) Pos. Parameter Voltages 16.1.1 Supply ...

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Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions ...

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Electrical Characteristics Table 14 Electrical Characteristics -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin = 13 (unless otherwise specified) Pos. Parameter V Current Consumption @ ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter 16.4.17 Output current limit 16.4.18 Drop ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter Reset Generator; Pin RESET 16.4.33 Reset ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter Low Side Output LS1 / LS2 ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter 16.4.65 Switch ON overcurrent shutdown blanking ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter 16.4.82 Receiver hysteresis 16.4.83 Wake-up threshold ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter 16.4.90 Bus pull-up resistance 16.4.91 LIN ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter 16.4.103 TxD dominant time out recovery ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter 16.4.114 Clock low after CSN high ...

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Table 14 Electrical Characteristics (cont’d) = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin 13 (unless otherwise specified) Pos. Parameter 16.4.135 Measurement accuracy after μController-based calibration ...

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Figure 14 SPI-Input Timing t t CWmax t CWmin closed window Figure 15 Watchdog Time-Out Definitions Data Sheet WD t OWmax t OWmin open window safe trigger area 46 TLE7824G Timing Diagrams WDPER Rev. 3.01, 2008-04-15 ...

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Trigger Reset Out Watchdog timer reset normal operation Figure 16 Watchdog Timing Diagram RTx t RD1 WD Trigger Reset Out Watchdog timer reset start up Figure 17 Reset ...

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TxD GND bus GND RxD GND Figure 18 LIN Dynamic Characteristics Timing Diagram Data Sheet t t d(L),T d(H),T V bus, d(H),R d(L),R 0.3 d(L),TR d(H),TR ...

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Application Information 18.1 Application Diagram Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of ...

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Flash Program Mode via LIN-Fast-Mode For flash programming the transmission rate of the integrated LIN transceiver can be changed to maximum 115 kBaud via SPI command. A dedicated BROM routine of the XC885 takes care of periodically servicing the ...

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Package Outlines 1.27 +0. Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion of 0.05 max. per side Figure 21 PG-DSO-28-38 (Plastic Dual ...

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Revision History Revision Date Changes 3.01 2008-04-15 Chapter 16.3 Thermal Resistance - corrected RthJSP 3.00 2008-04-04 Initial datasheet version Data Sheet (16.3.1) 52 TLE7824G Revision History Rev. 3.01, 2008-04-15 ...

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... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life ...

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