VQFN-8 Infineon Technologies, VQFN-8 Datasheet

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VQFN-8

Manufacturer Part Number
VQFN-8
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of VQFN-8

Applications
Embedded Security, Authentication, Integrity
Pitch
1.27 mm
Dimensions
5 x 6
Thickness (max.)
900.0 µm
Contact Surface
NiPdAuAg
Surface Mount Device
Small Outline No-Lead
Exposed pad
VQFN-8
Short Product Overview
May 2010
Chip Card & Security

Related parts for VQFN-8

VQFN-8 Summary of contents

Page 1

... VQFN-8 Surface Mount Device Small Outline No-Lead Exposed pad Short Product Overview May 2010 Chip Card & Security ...

Page 2

... VQFN-8 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Chip Card & Security E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...

Page 3

... VQFN-8 Picture Product description Surface Mount Device Small Outline No-Lead Exposed pad Embedded Security Typical Applications Authentication Ingetrity Pitch 1.27 mm Dimensions Body Thickness max. 900µm Contact Surface NiPdAuAg Delivery form Tape on Reel Reel diameter 330mm ISO - reference - Derivatives - VQFN-8 ...

Page 4

... Published by Infineon Technologies AG ...

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