BSL202SN Infineon Technologies, BSL202SN Datasheet
BSL202SN
Specifications of BSL202SN
Available stocks
Related parts for BSL202SN
BSL202SN Summary of contents
Page 1
... =7 = /dt di /dt =200 A/µs, =150 °C T j,max V GS =25 ° tot stg JESD22-A114 -HBM page 1 BSL202SN DS(on),max GS =2 7.5 TSOP Marking Lead Free Packing sPD Yes Non dry Value 7.5 6.0 30 ...
Page 2
... GSS DS( |>2 DS(on)max (single layer, 70 µm thick) copper area for drain page 2 BSL202SN Values Unit min. typ. max K 230 - - 62 0.7 0.95 1.2 μ 100 - - 100 mΩ ...
Page 3
... plateau I S =25 ° S,pulse = =7 =25 ° = =7 /dt =100 A/µ page 3 BSL202SN Values Unit min. typ. max. - 863 1147 pF - 278 370 - 1.82 2. 1.1 1.6 - 5.8 8 ...
Page 4
... A 4 Max. transient thermal impedance =f(t Z thJA p parameter µs 100 µ [V] DS page 4 BSL202SN ≥4 120 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 160 ...
Page 5
... [ Typ. forward transconductance =f ° [V] GS page 5 BSL202SN ); T =25 ° 1 2 3 [A] D =25 ° [ ...
Page 6
... Forward characteristics of reverse diode =25°C =f parameter Ciss 0 10 Coss -1 10 Crss - [V] DS page 6 BSL202SN ); =30 µ typ 100 140 T [° °C 150 °C, 98% 150 °C 25 °C, 98% 0.4 0.8 1 ...
Page 7
... Gate charge waveforms s(th) Q g(th) 60 100 140 [°C] j page 7 BSL202SN ); I =7.5 A pulsed [nC] gate ate 2011-05-23 ...
Page 8
... Package Outline: 2.9 ±0.2 (2.25) (0.35 0.35 0.95 1.9 Footprint: 0.5 0.95 Remark: Wave soldering possible dep. on customers process conditions Dimensions in mm Rev 1.08 TSOP6 B 0.1 MAX. +0.1 -0.05 0 Packaging: Pin 1 marking HLG09283 page 8 BSL202SN 1.1 MAX. A +0.1 0.15 -0.06 0 GPX09300 0.2 4 3.15 1.15 CPWG5899 2011-05-23 ...
Page 9
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev 1.08 page 9 BSL202SN 2011-05-23 ...