NCSE119A Nichia, NCSE119A Datasheet - Page 16

• Manufacturer Part Number: NCSE119A
• Manufacturer: Nichia

Specifications of NCSE119A

• Size Lxwxh (mm): 3.5x3.5x2.0
• Lumi-nous Inten-sity Typ(cd): 31
• Lumi-nous Flux Typ(lm)): 98.0
• Forward Voltage Vf(v) Typ: 3.50
• Forward Voltage Vf(v) Max: 4.00
• Directivity (degree): 120
• If (ma): 350
• Mounting Style: Through Hole

(4) Design Consideration
(5) Electrostatic Discharge (ESD)
(6) Thermal Management
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not using hands.
● If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
● Proper grounding is required for all devices, equipment, and machinery used in product assembly.
● If tools or equipment contain insulating materials such as glass or plastic,
● The customer is advised to check if the LEDs are damaged by ESD
● ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current.
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
● Drive current should be determined for the surrounding ambient temperature (T
● The following equations can be used to calculate the junction temperature of the products.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
Thermal stress during use can cause the solder joints to crack.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Surge protection should be considered when designing of commercial products.
the following measures against electrostatic discharge are strongly recommended:
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA).
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (T
1) T
Ts Point
Eliminating the charge
Grounded wriststrap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
Failure Criteria: V
*T
T
T
R
R
W=Input power(I
J
=T
A
S
θJA
θJS
J
=LED junction temperature: °C
=Ambient temperature: °C
=Soldering temperature (cathode side): °C
A
=Thermal resistance from junction to ambient: °C/W
=Thermal resistance from junction to T
+R
θJA
･W
F
<2.0V at I
F
×V
2) T
F
): W
J
=T
F
S
=0.5mA
+R
θJS
･W
S
measuring point: °C/W
J
).
A
) to dissipate the heat from the product.
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