HS1D Taiwan Semiconductor Company, Ltd. (TSC), HS1D Datasheet

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HS1D

Manufacturer Part Number
HS1D
Description
Manufacturer
Taiwan Semiconductor Company, Ltd. (TSC)
Datasheet
Features
Mechanical Data
Maximum Ratings and Electrical Characteristics
Rating at 25
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
See Fig.1
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@ 1.0A
Maximum DC Reverse Current @ T
at Rated DC Blocking Voltage @ T
Maximum Reverse Recovery Time ( Note 1)
Typical Junction Capacitance ( Note 2 )
Maximum Thermal Resistance (Note 3)
Operating Temperature Range
Storage Temperature Range
Notes:
Type Number
Glass passivated junction chip.
For surface mounted application
Low forward voltage drop
Low profile package
Built-in stain relief, ideal for automatic
placement
Fast switching for high efficiency
High temperature soldering:
260
Plastic material used carries Underwriters
Cases: Molded plastic
Terminals:
Polarity: Indicated by cathode band
Packing: 12mm tape per EIA STD RS-481
Weight: 0.064 gram
Laboratory Classification 94V0
o
C/10 seconds at terminals
1. Reverse Recovery Test Conditions: I
2. Measured at 1 MHz and Applied V
3. Mounted on P.C.Board with 0.2” x 0.2” (5mm x 5mm) Copper Pad Area.
o
C ambient temperature unless otherwise specified.
Pure tin plated, lead free
A
A
=125
=25
o
o
C
C
1.0 AMP. High Efficient Surface Mount Rectifiers
Symbol
V
V
R
T
I
V
I
R
FSM
Trr
(AV)
RRM
V
RMS
Cj
STG
I
θJA
T
=4.0 Volts.
DC
R
F
F
J
=0.5A, I
- 270 -
HS
1A
50
35
50
R
=1.0A, I
100
100
HS
1B
70
1.0
Dimensions in inches and (millimeters)
RR
200
140
200
HS
1D
50
20
=0.25A
-55 to +150
-55 to +150
300
210
300
SMA/DO-214AC
HS
1F
150
1.0
5.0
70
30
400
280
400
1.3
HS
1G
HS1A - HS1M
600
420
600
HS
1J
800 1000
560
800 1000
1.7
HS
1K
75
15
700
HS
1M
Version: B07
Units
o
C/W
uA
uA
nS
pF
o
o
V
V
V
A
A
V
C
C

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HS1D Summary of contents

Page 1

Features Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: o 260 C/10 seconds at terminals Plastic material used ...

Page 2

RATINGS AND CHARACTERISTIC CURVES (HS1A THRU HS1M) FIG.1- MAXIMUM AVERAGE FORWARD CURRENT DERATING 1.2 1.0 0.8 0.6 0.4 0 100 110 120 O LEAD TEMPERATURE FIG.3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms ...

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