FSMD1206 DB Lectro Inc, FSMD1206 Datasheet

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... FUZETEC Product Specification and Approval Sheet Surface Mountable PTC Resettable Fuse: FSMD1206 Series 1. Summary (a) RoHS Compliant (Lead Free) Product (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0 ...

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... FSMD100-1206R 2 3.00 FSMD110-1206R 2 3.00 FSMD150-1206R 2 3.00 FSMD200-1206R 2 3.00 5. Thermal Derating Curve 200% 150% 100% 50% 0% -40 NOTE : Specification subject to change without notice. TECHNOLOGY CO., LTD Max Min Max 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 3.50 1.50 1.80 Thermal Derating Curve, FSMD1206 Series - Ambient Temperature (C) NO. PQ18-01E Version 12 Page C D Min Max Min Max 0.45 0.85 0.10 0.75 0.45 0.85 0.10 0.75 0.45 0.75 0.10 0.75 0.45 0.75 0.10 0.75 0.25 0.55 0.10 0.75 0.45 1.25 0.25 0.75 0.45 1.00 0.25 0.75 0.45 1.00 0.25 0.75 0.80 1.40 0.25 0.75 0.85 1.60 0.25 0.75 ...

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FUZETEC Product Specification and Approval Sheet 6. Typical Time-To-Trip at 23℃ ℃ ℃ ℃ Z =FSMD005-1206 A =FSMD010-1206 B =FSMD020-1206 100 C =FSMD035-1206 D =FSMD050-1206 E =FSMD075-1206R F =FSMD100-1206R 10 G =FSMD110-1206R H =FSMD150-1206R I = FSMD200-1206R 0.1 0.01 0.001 ...

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... FUZETEC Product Specification and Approval Sheet 9. Pad Layouts、 、 、 、 Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1206 device Profile Feature Average Ramp-Up Rate (Tsmax to Tp) 3 Preheat : Temperature Min (Tsmin) ...