CRG03 TOSHIBA Semiconductor CORPORATION, CRG03 Datasheet
CRG03
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CRG03 Summary of contents
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... °C °C JEDEC ― JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) Min Typ. Max ⎯ 0.86 ⎯ 0.97 ⎯ 1.0 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 130 ⎯ ⎯ 2006-11-06 CRG03 Unit: mm Unit ⎯ V 1.1 V ⎯ V μ °C/W 20 °C/W ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit CRG03 2006-11-06 ...
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... Board thickness 1.2 10000 (1) Device mounted on a ceramic board: Soldering land × (2) Device mounted on a glass-epoxy board: Soldering land × 1000 100 10 1 100 0.001 0.01 3 CRG03 P – (AV) F (AV) 0.4 0.6 0.8 1.0 1.2 (A) F (AV) Device mounted on a glass-epoxy board □ □ ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CRG03 20070701-EN 2006-11-06 ...