CMG02 TOSHIBA Semiconductor CORPORATION, CMG02 Datasheet

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CMG02

Manufacturer Part Number
CMG02
Description
Toshiba Rectifier Silicon Diffused Type
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.CMG02.pdf (4 pages)

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General-Purpose Rectifier Applications
•
•
•
Absolute Maximum Ratings
Electrical Characteristics
Average forward current: I
Repetitive peak reverse voltage: V
Suitable for high-density board assembly due to the use of a small
surface-mount package, M−FLAT
Repetitive peak reverse voltage
Average forward current
Non-repetitive peak surge current
Junction temperature
Storage temperature
Note: Using continuously under heavy loads (e.g. the application of high
Peak forward voltage
Peak repetitive reverse current
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and
individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Characteristics
Characteristics
F (AV)
TOSHIBA Rectifier Silicon Diffused Type
(Ta = 25°C)
= 2.0 A
TM
RRM
(Ta = 25°C)
Symbol
I
V
F (AV)
I
T
FSM
RRM
T
Symbol
R
= 400 V
stg
V
V
R
I
j
th (j-a)
FM(1)
FM(2)
RRM
th (j-ℓ)
CMG02
80 (50 Hz)
−40 to 150
−40 to 150
I
I
V
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 mm)
FM
FM
RRM
Rating
400
2.0
=1.0 A
= 2.0 A
1
= 400 V
Test Condition
―
Unit
°C
°C
V
A
A
Weight: 0.023 g (typ.)
JEDEC
JEITA
TOSHIBA
1.75 ± 0.1
2.4
Min
―
―
―
―
―
―
―
②
①
+ 0.2
− 0.1
Typ.
0.86
0.9
―
―
―
―
―
―
―
3-4E1A
2008-03-03
Max
110
180
1.1
10
60
16
―
① ANODE
② CATHODE
CMG02
0.16
Unit: mm
°C/W
°C/W
Unit
μA
V
V

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CMG02 Summary of contents

Page 1

... JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. Max ― 0.86 ― 0.9 ― ― ― ― 110 ― ― 180 ― ― ― ― 2008-03-03 CMG02 Unit: mm 0.16 ① ANODE ② CATHODE Unit ― μA 60 °C/W 16 °C/W ...

Page 2

... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit: mm 1.4 2 CMG02 2008-03-03 ...

Page 3

... Soldering land: 2.1 mm × 1.4 mm 100 board thickness: 1 Device mounted on a ceramic 1 board: board size × Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 mm 0.1 50 100 0.001 0.01 3 CMG02 P – (AV) F (AV) 180° 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 (A) F (AV) Ta max – (AV) Half-sine waveform 0° 180° ...

Page 4

... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CMG02 20070701-EN GENERAL 2008-03-03 ...

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