NS2L095BT NICHIA CORPORATION, NS2L095BT Datasheet - Page 7

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NS2L095BT

Manufacturer Part Number
NS2L095BT
Description
Specifications For Nichia Chip Type Warm White Led
Manufacturer
NICHIA CORPORATION
Datasheet
· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.
· The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and
Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist
and warpage of the board.
When mechanical stress from the board affects the soldered LED, place the LED in the preferable
changed. Refer to the following figure.
Hand brake without these tools and equipment may not be used.
subsequently may result in solder joint crack. Customers may need to evaluate their specific
application to determine any impact due to the use of aluminum substrate.
location and orientation as shown above.
Perforated line
【Non-preferable】
Cathode mark
Stress : A > B = C > D > E
-6-
【Preferable】
Slit
Cathode mark
Nichia STS-DA1-0370A
<Cat.No.090311>

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