130MR2C HB Electronic Components, 130MR2C Datasheet - Page 7

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130MR2C

Manufacturer Part Number
130MR2C
Description
Led Specification
Manufacturer
HB Electronic Components
Datasheet
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
yFORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
should be performed with base fixed means of a jig or pliers (Fig.7)
against the LED is prevented. (Fig.8)
Fig.5
Stand-off
LED LAMP APPLICATION
Tube
Fig.6
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