MSC8156 Freescale Semiconductor, Inc, MSC8156 Datasheet - Page 25

• Manufacturer Part Number: MSC8156
• Description: Six-core Digital Signal Processor
• Manufacturer: Freescale Semiconductor, Inc

2.3
Table 4
2.4
Table 5
2.5
This section describes the DC electrical characteristics for the MSC8156.
2.5.1
This section describes the DC electrical specifications for the DDR SDRAM interface of the MSC8156.
Note:
Freescale Semiconductor
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Notes:
CLKIN duty cycle
CLKIN slew rate
CLKIN peak period jitter
CLKIN jitter phase noise at –56 dBc
AC input swing limits
Input capacitance
Notes:
describes thermal characteristics of the MSC8156 for the FC-PBGA packages.
summarizes the required characteristics for the CLKIN signal.
DDR2 SDRAM uses V
1.
2.
3.
4.
1.
2.
3.
4.
Parameter/Condition
Thermal Characteristics
CLKIN Requirements
DC Electrical Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESDC51-6. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-board thermal resistance determined per JEDEC JESD 51-8. Thermal test board meets JEDEC specification for
the specified package.
Junction-to-case at the top of the package determined using MIL- STD-883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer
For clock frequencies, see the Clock chapter in the MSC8156 Reference Manual.
Measured at the rising edge and/or the falling edge at V
Slew rate as measured from ±20% to 80% of voltage swing at clock input.
Phase noise is calculated as FFT of TIE jitter.
DDR SDRAM DC Electrical Characteristics
4
1, 2
Characteristic
3
MSC8156 Six-Core Digital Signal Processor Data Sheet, Rev. 1
DDDDR
1
1, 2
Table 4. Thermal Characteristics for the MSC8156
(typ) = 1.8 V and DDR3 SDRAM uses V
Table 5. CLKIN Requirements
Symbol
ΔV
C
—
—
—
—
IN
AC
Symbol
R
R
R
R
θJC
θJA
θJA
θJB
DDIO
Min
1.5
40
—
—
—
1
/2.
Convection
Typ
—
—
—
—
—
—
Natural
DDDDR
0.6
18
13
5
29
FC-PBGA
(typ) = 1.5 V.
×
Max
±150
500
29 mm
60
—
15
4
(1 m/s) airflow
200 ft/min
2
Electrical Characteristics
12
9
Unit
V/ns
KHz
ps
%
pf
V
Notes
°C/W
°C/W
°C/W
°C/W
Unit
—
—
—
2
3
4
25