MD18R3268AG0 Samsung Semiconductor, Inc., MD18R3268AG0 Datasheet - Page 14

• Manufacturer Part Number: MD18R3268AG0
• Description: Description = MD18R3268AG0 (32Mx18)x8(16)pcs RIMM(TM) Module Based on 576Mb A-die, 32s Banks,32K/32ms Ref, 2.5V ;; Density(MB) = 512 ;; Organization = 128Mx36 ;; Component Composition = 576M(2th)x8 ;; Voltage(V) = 2.5 ;; Refresh = 32K/32ms ;; Speed(M
• Manufacturer: Samsung Semiconductor, Inc.

MD18R3268(G)AG0
Physical Dimensions -2 ( For Heat Spreader )
The following defines the 2 channel RDRAM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of ±0.127[±0.005].
WARNING ! HOT SURFACE
DIA 2.36
SECTION A-A
±
0.05[0.09
WARNING ! HOT SURFACE
Heat Spreader
Thermal
Conductive
Gap Filling
Material
[ Single side module ]
±
0.001]
12.7
±
0.07[0.5
Figure 4: Heat Spreader Physical Dimensions
118.15
132.76
127.66
±
0.002]
Max 4.70
[0.050
Center-Point
CSP
[0.185]
±
1.27
PCB
±
±
0.12[4.652
0.25[5.226
0.12[5.023
±
±
0.10
0.004]
12.7
133.35
±
±
±
±
0.07[0.5
0.005]
0.009]
0.005]
±
Page 13
0.127[5.250
A
A
±
http://www.samsungsemi.com
0.002]
±
0.005]
SECTION A-A
http://www.samsungsemi.com
[ Double side module ]
32 Bit RIMM
Version 0.1 Sept. 2003
[0.050
Heat Spreader
1.27
CSP
PCB
Max 7.80
Thermal
Conductive
Gap Filling
Material
[0.307]
±
±
0.10
0.004]
Preliminary
®
Module
[0.04
2.9
1.00
[0.114]
±
±
0.002]
0.07