MD18R3268AG0 Samsung Semiconductor, Inc., MD18R3268AG0 Datasheet - Page 16

• Manufacturer Part Number: MD18R3268AG0
• Description: Description = MD18R3268AG0 (32Mx18)x8(16)pcs RIMM(TM) Module Based on 576Mb A-die, 32s Banks,32K/32ms Ref, 2.5V ;; Density(MB) = 512 ;; Organization = 128Mx36 ;; Component Composition = 576M(2th)x8 ;; Voltage(V) = 2.5 ;; Refresh = 32K/32ms ;; Speed(M
• Manufacturer: Samsung Semiconductor, Inc.

MD18R3268(G)AG0
Table Of Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key Timing Parameters/Part Numbers . . . . . . . . . . . . . . . . 1
Module Pad Numbers and Signal Names . . . . . . . . . . . 2 - 3
Module Connector Pad Description . . . . . . . . . . . . . . . 3 - 6
32 bit RIMM Module Functional Diagram . . . . . . . . . . . . . 7
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . 8
DC Recommended Electrical Conditions . . . . . . . . . . . . . . 8
32 bit RIMM Module Supply Current Profile. . . . . . . . . . . 9
AC Electrical Specifications . . . . . . . . . . . . . . . . . . . 10 - 11
Physical Dimensions -1 ( For PCB ) . . . . . . . . . . . . . . . . . 12
Physical Dimensions -2 ( For Heat Spreader) . . . . . . . . . . 13
Standard 32 bit RIMM Module Marking . . . . . . . . . . . . . 14
Page 15
Copyright © September 2003, Samsung Electronics.
All rights reserved.
Direct Rambus and Direct RDRAM, SO-RIMM and RIMM
are trademarks of Rambus Inc. Rambus, RDRAM, and the
Rambus Logo are registered trademarks of Rambus Inc.
This document contains advanced information that is subject
to change by Samsung Electronics without notice
Document Version 0.1 Samsung Electronics Co. Ltd.
San #16 Banwol-ri, Taean-Eup Hwasung-City,
Gyeonggi-Do, KOREA
Telephone: [phone]
Fax: [phone]
http://www.intl.samsungsemi.com
32 Bit RIMM
Version 0.1 Sept. 2003
Preliminary
®
Module