MD18R3268AG0 Samsung Semiconductor, Inc., MD18R3268AG0 Datasheet - Page 8
MD18R3268AG0
Manufacturer Part Number
MD18R3268AG0
Description
Description = MD18R3268AG0 (32Mx18)x8(16)pcs RIMM(TM) Module Based on 576Mb A-die, 32s Banks,32K/32ms Ref, 2.5V ;; Density(MB) = 512 ;; Organization = 128Mx36 ;; Component Composition = 576M(2th)x8 ;; Voltage(V) = 2.5 ;; Refresh = 32K/32ms ;; Speed(M
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
1.MD18R3268AG0.pdf
(16 pages)
MD18R3268(G)AG0
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SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
Left RDRAM Device of "Term" Channel
Right RDRAM Device of "Term" Channel
Right RDRAM Device of "Thru" Channel
Left RDRAM Device of "Thru" Channel
Figure 1: 32 bit RIMM Module Functional Diagram
(576Mb)
(576Mb)
(576Mb)
(576Mb)
Page 7
32 Bit RIMM
Version 0.1 Sept. 2003
V
term
V
Gnd
term
SCL
SWP
SV
SA0
SA1
SA2
47Kohm
SV
Gnd
Vdd
Gnd
V
Gnd
V
Gnd
Serial Presence Detect
REF
CMOS
Capacity
DD
1152MB
DD
Module
576MB
Preliminary
SCL
SWP
A0 A1
1 per
2 termination
resistors
®
Near Connector
0.22µF
1 per
2 RDRAM devices
Plus one
0.22µF
2 per
RDRAM device
1 per
2 RDRAM devices
0.22µF
0.22µF
Module
Vcc
A2
SDA
16
N
U0
8
SDA