HA17358A Renesas, HA17358A Datasheet - Page 9

• Manufacturer Part Number: HA17358A
• Manufacturer: Renesas

Solder Mounting Method
1. Small and light surface-mount packages require spicial attentions on solder mounting.
2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a
On solder mounting, pre-heating before soldering is needed.
The following figure show an example of infrared rays refow.
failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress.
Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic
substrates.
Figure 1 An Example of Infrared Rays Reflow Conditions
140 to 160°C
1 to 5°C/s
≅ 60 s
235°C Max
Time (s)
1 to 4°C/s
10 s Max
Rev.2, May 2001, page 7 of 7
HA17358A Series