ISL73128RH Intersil Corporation, ISL73128RH Datasheet
ISL73128RH
Related parts for ISL73128RH
ISL73128RH Summary of contents
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... ISL73096RH consists of three NPN transistors and two PNP transistors on a common substrate. The ISL73127RH consists of five NPN transistors on a common substrate. The ISL73128RH consists of five PNP transistors on a common substrate. One of our bonded wafer, dielectrically isolated fabrication processes provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment ...
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... Pinouts ISL73096RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW Q1B 1 2 Q1E www.datasheet4u.com 3 Q1C 4 Q2E 5 Q2B 6 Q2C 7 Q3E 8 Q3B 2 ISL73096RH, ISL73127RH, ISL73128RH 16 Q1C NC 15 Q5C Q2C 14 Q5B Q2E 13 Q5E Q2B 12 NC Q4C 11 Q4B Q3C 10 Q4E Q3E 9 Q3C Q3B ISL73128RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW ...
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... Type: Metal 2: AlCu (2%) Å Thickness: Metal 2: 16k ±0.8k Substrate: UHF-1X Bonded Wafer, DI Backside Finish: Silicon Metallization Mask Layout 3 ISL73096RH, ISL73127RH, ISL73128RH ASSEMBLY RELATED INFORMATION: Substrate Potential: ADDITIONAL INFORMATION: Worst Case Current Density: Transistor Count: Å Å (3) Q2E (4) Q2B (5) NC (6) Q3C FIGURE 1 ...
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... No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 4 ISL73096RH, ISL73127RH, ISL73128RH (Continued) (2) Q2C (1) Q1C (16) Q1E (15) Q1B (7) Q3E (8) Q3B (9) Q4B (10) Q4E FIGURE 2. ISL73128RH (14) Q5B (13) Q5E (12) Q5C (11) Q4C FN6475.2 March 23, 2009 ...
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... Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when sol- der dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH 5 ISL73096RH, ISL73127RH, ISL73128RH K16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A SYMBOL ...