RS2012 Orister Corporation, RS2012 Datasheet - Page 6
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RS2012
Manufacturer Part Number
RS2012
Description
Low Power Off-line Smps Primary Switcher
Manufacturer
Orister Corporation
Datasheet
1.RS2012.pdf
(7 pages)
Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10
2. Reflow soldering of surface-mount devices
3. Flow (wave) soldering (solder dipping)
Figure 1: Temperature profile
Average ramp-up rate (T
Preheat
- Temperature Min (Ts
- Temperature Max (Ts
- Time (min to max) (ts)
Tsmax to T
- Ramp-up Rate
Time maintained above:
- Temperature (T
- Time (t
Peak Temperature (T
Time within 5
Temperature (t
Ramp-down Rate
Time 25
Pb devices.
Pb-Free devices.
DS-RS2012-01
o
L
C to Peak Temperature
)
Profile Feature
L
Products
o
C of actual Peak
P
25
)
T
T
July, 2008
L
P
L
)
P
Ts
)
Ts
min
max
min
max
L
)
)
to T
P
)
Preheat
t 25
t
o
S
C~35
Sn-Pb Eutectic Assembly
o
C to Peak
Peak temperature
o
C Humidity=65%±15%
240
260
Time
60~120 sec
60~150 sec
<6 minutes
245
Ramp-up
10~30 sec
<3
<3
<6
o
o
100
150
183
C +0/-5
C +0/-5
o
o
o
o
C ±5
C/sec
C/sec
C/sec
o
o
o
C
C
C
o
C
o
o
C
C
Ramp-down
t
P
t
L
Pb-Free Assembly
Critical Zone
T
Dipping time
260
L
60~180 sec
60~150 sec
<8 minutes
5sec ±1sec
5sec ±1sec
20~40 sec
to T
<3
<3
<6
o
150
200
217
C +0/-5
o
o
o
P
C/sec
C/sec
C/sec
o
o
o
www.Orister.com
C
C
C
o
C
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