D75108CW NEC, D75108CW Datasheet - Page 65

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D75108CW

Manufacturer Part Number
D75108CW
Description
Search -----> UPD75108CW
Manufacturer
NEC
Datasheet

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15. RECOMMENDED SOLDERING CONDITIONS
Devices Mounting Manual" (IEI-616).
Caution: Do not use two or more soldering methods in combination (except the pin partial heating
Caution: The wave soldering must be performed at the lead part only. Note that the solder must not be
Infrared Reflow
VPS
Wave Soldering
Pin Partial Heating
It is recommended that PD75104, 75106, and 75108 be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
For other soldering methods and conditions, please consult NEC.
Soldering Method
PD75108GF - xxx - 3BE: 64-pin plastic QFP (14 x 20 mm)
method).
directly contacted to the package body.
Wave Soldering
(Only for lead part)
Pin Partial Heating
PD75108CW - xxx : 64-pin plastic shrink DIP (750 mil)
Soldering Method
Table 15-1 Soldering Conditions of Surface Mount Type
Table 15-2 Soldering Conditions of Through-Hole Type
(210 C min.), number of times: 1
Package peak temperature: 215 C, time: 40 seconds max.
(200 C min.), number of times: 1
max., number of times: 1,
pre-heating temperature: 120 C max. (package surface
temperature)
time: 3 seconds max. (per side)
Package peak temperature: 230 C, time: 30 seconds max.
Soldering bath temperature: 260 C max., time: 10 seconds
Pin temperature: 300 C max.,
Soldering bath temperature: 260 C max., Time: 10 seconds max.
Pin temperature: 260 C max., Time: 10 seconds max.
Soldering Conditions
Soldering Conditions
PD75104, 75106, 75108
Symbol for Recommended
Condition
WS60-00-1
VP15-00-1
IR30-00-1
65

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