UPD75208 NEC, UPD75208 Datasheet - Page 57

• Manufacturer Part Number: UPD75208
• Description: 4-BIT SINGLE-CHIP MICROCOMPUTER
• Manufacturer: NEC

15. RECOMMENDED SOLDERING CONDITIONS
“Semiconductor Device Mount Technology” (IEI-1207).
* For the storage period after dry-pack decompression storage conditions are max. 25 C, 65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
Note
Soldering Method
Soldering Method
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions for the surface mounting type, refer to the document
For soldering methods and conditions other than those recommended below, contact our salesman.
Wave soldering
Infrared reflow
VPS
Pin part heating
Pin part heating
Wave soldering
(lead part only)
PD75208GF-
PD75208CW-
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
-3BE : 64-pin plastic QFP (body 14
Solder bath temperature: 260 C or less, Duration: 10 sec. max.
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Preheating temperature : 120 C max. (package surface temperature)
Package peak temperature: 230 C, Duration: 30 sec. max. (at 210 C or above),
Number of times: Once, Time limit: 7 days*(thereafter 10 hours prebaking required
at 125 C)
Package peak temperature: 215 C, Duration: 40 sec. max. (at 200 C or above),
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Pin part temperature: 300 C or below , Duration: 3 sec. max. (per device side)
Solder bath temperature: 260 C or below , Duration: 10 sec. max.
Pin part temperature: 260 C or below , Duration: 10 sec. max.
: 64-pin plastic shrink DIP (750 mil)
Table 15-1 Surface Mounting Type Conditions
Table 15-2 Insertion Type Soldering Conditions
Soldiering Conditions
Soldering Conditions
20 mm)
Condition Symbol
Recommended
WS60-107-1
IR30-107-1
VP15-107-1
PD75208
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