SBT-BGA-6002 Ironwood Electronics, SBT-BGA-6002 Datasheet

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SBT-BGA-6002

Manufacturer Part Number
SBT-BGA-6002
Description
Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
Manufacturer
Ironwood Electronics
Datasheet
Description: SBT-BGA Socket 27x27mm, 1mm, 26x26 array
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"],all other tolerances ±0.13mm [±0.005"] unless stated otherwise.
Materials and specifications are subject to change without notice.
4
16
12
5
www.ironwoodelectronics.com
Ironwood Electronics, Inc.
Tele: (800) 404-0204
7
SBT-BGA-6002 Drawing
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
17
WEIGHT:
MATERIAL:
FINISH:
BURN-IN AND TEST APPLICATIONS
6
11
13
9
1
2
14
3
8
STATUS: Released
DRAWN BY: Vinayak R
File: SBT-BGA-6002 Dwg
Features
Wide temperature range (-55C to +180C)
High current capability (up to 8A)
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable
production yield
Highly compliant to accommodate wide co-planarity
variations
Automated probe manufacturing enables low cost
and short lead time
ITEM
NO.
10
11
12
13
14
15
16
17
1
2
3
4
5
6
7
8
9
BGA with 676pin with 1mm Pitch
Socket Base SBT 27x27
SBT-BGA pin 1mm pitch
Backing Plate 27x27mm
Socket Base Cap Screw
Floating Guide Spring
Test PCB BGA676C
0-80 Shoulder screw
Compression Screw
Compression PLate
Pogo Guide Screw
Insualtion Plate
Floating Guide
Bottom Guide
Middle Guide
Description
Socket Lid
Dowel pin
SHEET 1 OF 4
SCALE: 3:1
DATE: 11/13/2009
BeCu, Au PLATED OVER Ni
AISI 321 Annealed Stainless
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
Material <not specified>
Chrome Stainless Steel
PEEK Ceramic filled
PEEK Ceramic filled
PEEK Ceramic filled
Stainless steel
FR4/Ultem
Alloy Steel
Steel (SS)
Material
FR4
REV. A

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SBT-BGA-6002 Summary of contents

Page 1

... Shoulder screw 15 Dowel pin 16 Floating Guide Spring 17 Pogo Guide Screw STATUS: Released DRAWN BY: Vinayak R File: SBT-BGA-6002 Dwg Material FR4 FR4/Ultem PEEK Ceramic filled PEEK Ceramic filled 7075-T6 Aluminum Alloy Material <not specified> 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy PEEK Ceramic filled ...

Page 2

... FINISH: 32.6000±0.1250 *12.1250 1 25 29.7250±0.0500 STATUS:Released DRAWN BY: Vinayak R File: SBT-BGA-6002 Dwg *Note: BGA pattern is not symmetrical with respect to the mounting holes. 0.8500 Non Plated Hole 12.3225 0.5100 (x676 pad) 1.7000±0.1000 Non Plated Hole Target PCB Recommendations Total thickness: 1 ...

Page 3

... Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of 0.2 Z package. 0.20 4 STATUS: Released DRAWN BY: Vinayak R File: SBT-BGA-6002 Dwg DIM Minimum Maximum A 2.5 A1 0.40 0.60 b 0.50 ...

Page 4

... SBT-BGA-6002 Drawing Ironwood Electronics, Inc. WEIGHT: Tele: (800) 404-0204 MATERIAL: www.ironwoodelectronics.com FINISH: 34.7250 6.3500 Insulation Plate Specification STATUS:Released DRAWN BY: Vinayak R File: SBT-BGA-6002 Dwg SBT PIN (scale 1:10 1.6100±0.0500 29.7250±0.0500 1.2700 SHEET SCALE: 3:2 DATE: 11/13/2009 1.6000 REV. A ...

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