TS8388BMFSB/QNB3 Atmel Corporation, TS8388BMFSB/QNB3 Datasheet - Page 38
TS8388BMFSB/QNB3
Manufacturer Part Number
TS8388BMFSB/QNB3
Description
ADC 8-bit 1 GSPS
Manufacturer
Atmel Corporation
Datasheet
1.TS8388BMFSBQNB3.pdf
(47 pages)
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Nominal CQFP68
Thermal
Characteristics
Thermal Resistance
from Junction to
Ambient: RTHJA
38
TS8388BF
Although the power dissipation is low for this performance, the use of a heat sink is
mandatory.
The user will find some advice on this topics below.
The following table lists the converter thermal performance parameters, with or without
heatsink.
For the following measurements, a 50 x 50 x 16 mm heatsink has been used (see Figure 47
on page 39).
Table 8. Thermal Resitance
Note:
Figure 46. Thermal Resistance from Junction to Ambient: Rthja
Air Flow
(m/s)
0.5
1.5
2.5
0
1
2
3
4
5
1. Heatsink is glued to backside of package or screwed and pressed with thermal grease.
Estimated – Without Heatsink
60
50
40
30
20
10
0
23.5
0
50
40
35
32
30
28
26
24
1
ja Thermal Resistance ( C/W)
CQFP68 on Board
Air flow (m/s)
2
3
Without heatsink
With heatsink
Targeted – With Heatsink
4
5
8.9
7.9
7.3
6.8
6.5
6.2
5.8
5.6
10
2144A–BDC–04/02
(1)
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