SC16C850V NXP Semiconductors, SC16C850V Datasheet - Page 44
SC16C850V
Manufacturer Part Number
SC16C850V
Description
XScale VLIO bus interface
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C850V.pdf
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NXP Semiconductors
13. Abbreviations
SC16C850V_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 40.
Acronym
CPU
FIFO
IrDA
ISDN
LSB
MSB
PCB
RoHS
UART
VLIO
Fig 16. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Single UART with 128-byte FIFOs, IrDA, and XScale VLIO bus interface
Description
Central Processing Unit
First In, First Out
Infrared Data Association
Integrated Service Digital Network
Least Significant Bit
Most Significant Bit
Printed-Circuit Board
Restriction of Hazardous Substances directive
Universal Asynchronous Receiver/Transmitter
Variable Latency Input/Output
Rev. 04 — 14 January 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
SC16C850V
peak
© NXP B.V. 2008. All rights reserved.
001aac844
time
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