mmft108t1 Freescale Semiconductor, Inc, mmft108t1 Datasheet

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mmft108t1

Manufacturer Part Number
mmft108t1
Description
N?channel Enhancement?mode Logic Level
Manufacturer
Freescale Semiconductor, Inc
Datasheet
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Field Effect Transistor
N–Channel Enhancement–Mode
Logic Level SOT–223
TMOS is a registered trademark of Motorola, Inc.
THERMAL CHARACTERISTICS
MAXIMUM RATINGS
DEVICE MARKING
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Drain – to–Source Voltage
Gate–to–Source Voltage — Continuous
Drain Current — Continuous
Total Power Dissipation
Operating and Storage Temperature Range
MT108
Thermal Resistance — Junction–to–Ambient (1)
Maximum Temperature for Soldering Purposes
1. Device mounted on FR4 glass epoxy printed circuit using minimum recommended foot print.
Motorola, Inc. 1997
@ T A = 25 C
Derate above 25 C
Maximum Time in Solder Bath
Rating
Symbol
T J , T stg
V DSS
V GS
P D
I D
– 65 to +150
Value
200
250
0.8
6.4
20
1
GATE
mW/ C
mAdc
Watts
3 SOURCE
Volts
Volts
Unit
2, 4 DRAIN
C
R JA
T L
MMFT108T1
CASE 318E–04, STYLE 3
SOT–223 (TO–261AA)
ENHANCEMENT
156
260
N–CHANNEL —
1
10
TRANSISTOR
TMOS FET
2
Order this document
3
by MMFT108T1/D
4
Sec
C/W
C
1

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mmft108t1 Summary of contents

Page 1

... Volts Volts I D 250 mAdc P D 0.8 Watts 6.4 mW stg – +150 Order this document by MMFT108T1/D MMFT108T1 TMOS FET TRANSISTOR N–CHANNEL — ENHANCEMENT CASE 318E–04, STYLE 3 SOT–223 (TO–261AA) 156 C/W 260 C 10 Sec 1 ...

Page 2

... MMFT108T1 ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage Zero Gate Voltage Drain Current ( 130 Gate–Body Leakage Current — Reverse ( Vdc CHARACTERISTICS (2) Gate Threshold Voltage ( 1.0 mAdc Static Drain– ...

Page 3

... Pad Area for the SOT-223 Package (Typical) Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MMFT108T1 0.8 Watts 1.5 Watts 1.25 Watts* ...

Page 4

... MMFT108T1 Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure ...

Page 5

... G 0.08 (0003) H Motorola Small–Signal Transistors, FETs and Diodes Device Data PACKAGE DIMENSIONS CASE 318E–04 ISSUE H TO-261AA MMFT108T1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.249 0.263 6 ...

Page 6

... JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 Motorola Small–Signal Transistors, FETs and Diodes Device Data MMFT108T1/D ...

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