mmft2n25e Freescale Semiconductor, Inc, mmft2n25e Datasheet

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mmft2n25e

Manufacturer Part Number
mmft2n25e
Description
Tmos E-fettm High Energy Power Fet
Manufacturer
Freescale Semiconductor, Inc
Datasheet
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Product Preview
TMOS E-FET
High Energy Power FET
N–Channel Enhancement–Mode Silicon Gate
withstand high energy in the avalanche mode and switch efficiently.
This new high energy device also offers a drain–to–source diode
with fast recovery time. Designed for high voltage, high speed
switching applications such as power supplies, PWM motor
controls and other inductive loads, the avalanche energy capability
is specified to eliminate the guesswork in designs where inductive
loads are switched and offer additional safety margin against
unexpected voltage transients.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
TMOS is a registered trademark of Motorola, Inc.
E–FET is a trademark of Motorola, Inc.
©
MAXIMUM RATINGS
UNCLAMPED DRAIN–TO–SOURCE AVALANCHE CHARACTERISTICS (T J < 150 C)
THERMAL CHARACTERISTICS
Motorola TMOS Power MOSFET Transistor Device Data
Drain–to–Source Voltage
Drain–to–Gate Voltage, R GS = 1.0 m
Gate–to–Source Voltage — Continuous
Gate–to–Source Voltage — Single Pulse (tp
Drain Current — Continuous @ T C = 25 C
Drain Current
Drain Current
Total Power Dissipation @ T C = 25 C
Total P D @ T A = 25 C mounted on 1 Sq. Drain Pad on FR–4 Bd. Material
Total P D @ T A = 25 C mounted on 0.7 Sq. Drain Pad on FR–4 Bd. Material
Total P D @ T A = 25 C mounted on min. Drain Pad on FR–4 Bd. Material
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting T J = 25 C
— Junction–to–Ambient on 1 Sq. Drain Pad on FR–4 Bd. Material
— Junction–to–Ambient on 0.7 Sq. Drain Pad on FR–4 Bd. Material
— Junction–to–Ambient on min. Drain Pad on FR–4 Bd. Material
Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
This advanced high voltage TMOS E–FET is designed to
Motorola, Inc. 1997
Avalanche Energy Capability Specified at Elevated
Temperature
Internal Source–to–Drain Diode Designed to Replace External
Zener Transient Suppressor – Absorbs High Energy in the
Avalanche Mode
Source–to–Drain Diode Recovery Time Comparable to
Discrete Fast Recovery Diode
Derate above 25 C
(V DD = 80 V, V GS = 10 V, Peak I L = 4.0 Apk, L = 3.0 mH, R G = 25 )
— Continuous @ T C = 100 C
— Single Pulse (tp
(T C = 25 C unless otherwise noted)
10
W
m
Rating
S)
50
m
S)
G
1
D
2,4
3
Symbol
T J , T stg
V DGR
V GSM
V DSS
R JA
S
V GS
E AS
I DM
P D
T L
I D
I D
®
– 55 to 150
MMFT2N25E
CASE 318E–04, STYLE 3
TMOS POWER FET
Value
0.77
250
250
103
162
260
2.0
0.6
7.0
6.2
1.0
1.2
0.8
26
90
R DS(on) = 3.5
20
40
2.0 AMPERES
1
250 VOLTS
TO–261AA
2
Order this document
3
by MMFT2N25E/D
mW/ C
4
Watts
Watts
Unit
Vdc
Vdc
Vdc
Vdc
Adc
Apk
C/W
mJ
W
C
C
1

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mmft2n25e Summary of contents

Page 1

... TMOS is a registered trademark of Motorola, Inc. E–FET is a trademark of Motorola, Inc. © Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1997 2 Order this document by MMFT2N25E/D MMFT2N25E TMOS POWER FET 2.0 AMPERES 250 VOLTS W R DS(on) = 3.5 ® CASE 318E–04, STYLE 3 TO–261AA ...

Page 2

... MMFT2N25E ELECTRICAL CHARACTERISTICS ( 25°C unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( 0.25 mA) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( 250 250 125°C) Gate–Body Leakage Current ( ± ...

Page 3

... Figure 4. On–Resistance versus Drain Current 100 1.0 100 125 150 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–to–Source Leakage Current MMFT2N25E 100°C – 55°C 25°C 4.5 5.0 5.5 6.0 6.5 7.0 7 1.5 2.0 2.5 3.0 3.5 4 DRAIN CURRENT (AMPS) and Gate Voltage 125° ...

Page 4

... MMFT2N25E 350 iss 300 250 200 C rss 150 100 50 C rss 0 –10 –5 GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 7. Capacitance Variation 100 25° 2 125 d(off) ...

Page 5

... TIME (seconds) Figure 13. Thermal Response between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.15 3.8 0.079 2.0 0.248 6.3 0.091 0.091 2.3 2.3 0.079 2.0 0.059 0.059 0.059 inches 1.5 1.5 1.5 SOT–223 MMFT2N25E 1.0E+1 1.0E+2 1.0E ...

Page 6

... B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89 F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100 J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1. 0.264 0.287 6.70 7.30 STYLE 3: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN Mfax is a trademark of Motorola, Inc. MMFT2N25E/D ...

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