MC74HC175ADG ON Semiconductor, MC74HC175ADG Datasheet - Page 3

MC74HC175ADG

Manufacturer Part Number

MC74HC175ADG

Description

IC FLIP FLOP QUAD TYPE D 16-SOIC

Manufacturer

ON Semiconductor

Series

74HCr

Type

D-Type Busr

Datasheet

1.MC74HC175ADG.pdf (10 pages)

Specifications of MC74HC175ADG

Function

Reset

Output Type

Differential

Number Of Elements

Number Of Bits Per Element

Frequency - Clock

35MHz

Delay Time - Propagation

28ns

Trigger Type

Positive Edge

Current - Output High, Low

5.2mA, 5.2mA

Voltage - Supply

2 V ~ 6 V

Operating Temperature

-55°C ~ 125°C

Mounting Type

Surface Mount

Package / Case

16-SOIC (3.9mm Width)

0837

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î

Î Î Î Î

Maximum ratings are those values beyond which device damage can occur. Maximum ratings

applied to the device are individual stress limit values (not normal operating conditions) and are

not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).

MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

DC ELECTRICAL CHARACTERISTICS

Symbol

, V

out

stg

, t

out

Î Î Î Î Î Î Î Î Î Î Î Î Î Î

Î Î Î Î Î Î Î Î Î

DC Supply Voltage (Referenced to GND)

DC Input Voltage (Referenced to GND)

DC Output Voltage (Referenced to GND)

DC Input Current, per Pin

DC Output Current, per Pin

DC Supply Current, V

Power Dissipation in Still Air,

Storage Temperature

Lead Temperature, 1 mm from Case for 10 Seconds

DC Supply Voltage (Referenced to GND)

DC Input Voltage, Output Voltage (Referenced to GND)

Operating Temperature, All Package Types

Input Rise and Fall Time

Minimum High−Level Input

Voltage

Maximum Low−Level Input

Voltage

Minimum High−Level Output

Voltage

(Figure 1)

SOIC Package: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

Parameter

(Plastic DIP, SOIC or TSSOP Package)

Parameter

and GND Pins

Î Î Î Î Î Î Î Î Î

TSSOP Package†

(Voltages Referenced to GND)

SOIC Package†

out

= V

| v 20 mA

= 0.1 V or V

Plastic DIP†

Test Conditions

or V

= 2.0 V

= 3.0 V

= 4.5 V

= 6.0 V

http://onsemi.com

MC74HC175A

Î Î Î Î Î

Î Î Î Î

Î Î

Î Î Î Î

Î Î

out

– 0.5 to V

– 0.1 V

– 55

Min

2.0

– 0.5 to + 7.0

– 65 to + 150

| v 2.4 mA

| v 4.0 mA

| v 5.2 mA

Î Î Î Î

Value

± 20

± 25

± 50

750

500

450

260

+ 125

1000

Max

600

500

400

6.0

Î Î Î Î

+ 0.5

Î Î Î

2.0

3.0

4.5

6.0

2.0

3.0

4.5

6.0

2.0

4.5

6.0

3.0

4.5

6.0

Unit

Î Î Î Î Î Î Î Î Î

Î Î Î Î

– 55 to

25_C

3.15

1.35

1.80

2.48

3.98

5.48

1.5

2.1

4.2

0.5

0.9

1.9

4.4

5.9

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, V

range GND v (V

tied to an appropriate logic voltage

level (e.g., either GND or V

Unused outputs must be left open.

Guaranteed Limit

out

This device contains protection

Unused inputs must always be

Î Î Î

should be constrained to the

v 85_C

3.15

1.35

1.80

2.34

3.84

5.34

1.5

2.1

4.2

0.5

0.9

1.9

4.4

5.9

Î Î Î Î

v 125_C

or V

3.15

1.35

1.80

2.20

3.70

5.20

1.5

2.1

4 2

0.5

0.9

1.9

4.4

5.9

out

Î Î Î

) v V

Unit

and

MC74HC175ADG ON Semiconductor, MC74HC175ADG Datasheet - Page 3

MC74HC175ADG

Specifications of MC74HC175ADG

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