ns2l095bt-h3 NICHIA CORPORATION, ns2l095bt-h3 Datasheet - Page 8

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ns2l095bt-h3

Manufacturer Part Number
ns2l095bt-h3
Description
Nichia Chip Type White Led General Lighting-surface Mount Type Led , Ns2l095bt-h3 Smt Led
Manufacturer
NICHIA CORPORATION
Datasheet
(5) Handling Precautions
· Bare Hand
· Tweezers
· Pick and Place
· Printed Circuit Board Assembled (PCB with LEDs soldered)
When handling the product, touching encapsulant with bare hands will contaminate its surface that could
affects on optical characteristics. In the worst cases, excessive force to the encapsulant by hands might
result in catastrophic failure of the LEDs due to wire deformation and/or breakage.
When handling it with tweezers, the product should only be held by the package body, on the short side.
Failure to comply might result in chip-out and/or delamination of encapsulant, and in the worst cases,
catastrophic failure of the LEDs due to wire deformation and/or breakage.
Recommended conditions : Area of outer nozzle ≥ 1.5 mm
Failure to comply might result in damage to encapsulant and in the worst cases,
catastrophic failure of the LEDs due to wire deformation and/or breakage.
Do not stack assembled PCBs together. Since silicone is a soft material, abrasion
between two PCB assembled with silicone encapsulated LED might cause catastrophic failure
of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire
(such as deformation and breakage) and LED detachment.
(more than 45% of encapsulant top surface)**
Contact area of nozzle with encapsulant ≥ 1.0 mm
(30 to 60% of encapsulant top surface)**
Placement pressure ≤ 3N/mm
Vacuum pressure ≤ 7.8N/ cm
**For reference.
-7-
2
2
2
(≤ 0.8 kgf/cm
*max. force : 5N
2
)
2
Nichia STS-DA1-0848A
<Cat.No.090714>

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