c450ut190-0317-31 Cree, Inc., c450ut190-0317-31 Datasheet

no-image

c450ut190-0317-31

Manufacturer Part Number
c450ut190-0317-31
Description
Manufacturer
Cree, Inc.
Datasheet
Cree
Data Sheet
CxxxUT190-Sxxxx-31
Cree’s UltraThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC
superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low
forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the
ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner
form factors are required.
FEATURES
CxxxUT190-Sxxxx-31 Chip Diagram
Small Chip – 190 x 190 x 50 μm
UT LED Performance
– 450 & 460 nm – 12 mW min.
– 470 nm – 10 mW min.
– 527 nm – 3.0 mW min.
Low Forward Voltage
– 2.9 V Typical at 5 mA
Single Wire Bond Structure
Class 2 ESD Rating
Top View
®
UltraThin™ Gen III LEDs
Junction
160 x 160 μm
Anode (+)
85-μm Diameter
t = 50 μm
Subject to change without notice.
Die Cross Section
www.cree.com
APPLICATIONS
Mobile Phone Keypads
Audio Product Display Lighting
Mobile Appliance Keypads
Automotive Applications
Bottom Surface
150 x 150 μm
190 x 190 μm
Cathode (-)
80 x 80 μm
Bottom View
®
substrate to deliver
1

Related parts for c450ut190-0317-31

c450ut190-0317-31 Summary of contents

Page 1

Cree UltraThin™ Gen III LEDs ® Data Sheet CxxxUT190-Sxxxx-31 Cree’s UltraThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner form factors are required. FEATURES • Small Chip – 190 x 190 x 50 μm • UT LED Performance – 450 & 460 nm – min. – 470 nm – min. – 527 nm – 3.0 mW min. • Low Forward Voltage ...

Page 2

... Notes 1& Forward Current Peak Forward Current (1/10 duty cycle @ 1 kHz) LED Junction Temperature Reverse Voltage Operating Temperature Range Storage Temperature Range Electrostatic Discharge Threshold (HBM) Note 2 Electrostatic Discharge Classification (MIL-STD-883E) Typical Electrical/Optical Characteristics at T Part Number Forward Voltage (V Min. C450UT190-Sxxxx-31 2.7 C460UT190-Sxxxx-31 2.7 C470UT190-Sxxxx-31 2.7 C527UT190-Sxxxx-31 2.7 Mechanical Specifications Description P-N Junction Area (μm) Chip Top Area (μm) Chip Bottom Area (μm) Chip Thickness (μm) Au Bond Pad Diameter (μm) Au Bond Pad Thickness (μ ...

Page 3

... LED chips are sorted to the radiant flux and dominant wavelength bins shown. Sorted die sheets contain die from only one bin. Sorted die kit (CxxxUT190-Sxxxx-31) orders may be filled with any or all bins (CxxxUT190-xxxx-31) contained in the kit. All radiant flux values are measured and all dominant wavelength values are measured mA. C450UT190-0317-31 18.0 mW C450UT190-0313-31 16.0 mW C450UT190-0309-31 14 ...

Page 4

... C527UT190-0307-31 7.0 mW C527UT190-0304-31 5.0 mW C527UT190-0301-31 3.0 mW 520 nm Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and G•SiC are registered trademarks, and UltraThin and UT are trademarks of Cree, Inc. 4 CPR3EP Rev A C470UT190-S1000-31 C470UT190-0314-31 C470UT190-0315-31 ...

Page 5

... If (mA) Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and G•SiC are registered trademarks, and UltraThin and UT are trademarks of Cree, Inc. 5 CPR3EP Rev A 500% 400% 300% ...

Page 6

... Radiation Pattern This is a representative radiation pattern for the UltraThin Chip LED product. Actual patterns will vary slightly for each chip. Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and G•SiC are registered trademarks, and UltraThin and UT are trademarks of Cree, Inc. 6 CPR3EP Rev A Cree, Inc. ...

Related keywords