ne5517 ON Semiconductor, ne5517 Datasheet - Page 14

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ne5517

Manufacturer Part Number
ne5517
Description
Dual Operational Transconductance Amplifier
Manufacturer
ON Semiconductor
Datasheet

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PUBLICATION ORDERING INFORMATION
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LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
NE5517, NE5517A, AU5517
A
A
C
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
S
P
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
SEATING
PLANE
PACKAGE DIMENSIONS
M
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
M
SOIC−16
PDIP−16
ISSUE J
ISSUE T
14
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
NOTES:
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
0
INCHES
A
B
C
D
G
K
M
P
R
F
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MILLIMETERS
MIN
MAX
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
0.70
10
1.27 BSC
0
_
_
10.00
MAX
MILLIMETERS
18.80
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
_
0
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
0
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
INCHES
10
_
_
NE5517/D
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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